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參數(shù)資料
| 型號(hào)： | HFBR-5302 |
| 英文描述： | 1300 nm 1x9 Transceiver(1300 nm 1x9 收發(fā)器) |
| 中文描述： | 1300納米1x9收發(fā)器（1300納米1x9收發(fā)器） |
| 文件頁數(shù)： | 2/4頁 |
| 文件大?。?/td> | 34K |
| 代理商： | HFBR-5302 |
2
2. Mechanical and Environmental Tests
(Testing done on a constructional basis)
Test
Conditions
Duration
Sample Size
(HFBR-5103)
21
Failure
Temp. Cycle 1
0
°
C to 100
°
C,
15 min. dwell
5 min. transfer
-40
°
C to 100
°
C,
15 min. dwell
5 min. transfer
-40
°
C to 150
°
C,
15 min. dwell
5 min. transfer
T
A
= 85
°
C, 85% RH,
V
cc
= +5 V.
(See note 1)
T
A
= 85
°
C, 85% RH,
V
cc
= 0 V
MIL-STD-883 Method
1004, Power On/Off
@ 30 min./30 min.
(See note 1)
T
A
= -40
°
C,
V
cc
= +5 V (See note 1)
T
A
= 150
°
C,
V
cc
= 0
-40
°
C to 100
°
C,
5 min. dwell,
5 sec. transfer
MIL-STD-883 Method
2002A, 500g
6 Directions
MIL-STD-883 Method
2007A 20-2000 Hz, 20g
MIL-STD-883, Method
2004.5 / 1 kg tensile pull,
10 sec./ 1 kg bending
pull, 3 sec., 30 deg.
1000 cycles
0
Temp. Cycle 2
1000 cycles
40
0
Temp. Cycle 3
1000 cycles
4
0
85/85
Biased
1000 hours
59
0
85/85
Storage
Power Cycle,
Temp. Cycle &
Humidity
240 hours
44
0
1000 hours
40
0
LTOL
2000 hours
11
0
High Temp
Storage
Thermal
Shock
1000 hours
3
0
100 cycles
11
0
Mechanical
Shock
11
0
Mechanical
Vibration
Lead / Terminal
Strength
11
0
1 kg tensile pull applied to
each lead for 10 sec., then
bend lead 30
°
while
under pull for 3 sec.
3 bendings each lead.
3 Times
10
0
Wave Soldering
2 sec. on 260
°
C Solder;
5 min. Wash in 60-70
°
C
DI water under 40 psi;
20 min. Bake @ 70
°
C
315
°
C - 10 sec.
Hand Soldering,
followed by Resistance
to Solvents per MIL-
STD-883 Method
2015.7
193
0
Hand Soldering
and Resistance
to Solvents
4
0
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