參數(shù)資料
型號: HGTD3N60C3
廠商: Harris Corporation
英文描述: 6A, 600V, UFS Series N-Channel IGBTs
中文描述: 第6A,600V的,的ufs系列N溝道IGBT的
文件頁數(shù): 7/9頁
文件大?。?/td> 227K
代理商: HGTD3N60C3
7
HGTD3N60C3, HGTD3N60C3S
TO-251AA
3 LEAD JEDEC TO-251AA PLASTIC PACKAGE
LEAD 1
-
GATE
LEAD 2
-
COLLECTOR
LEAD 3
-
EMITTER
TERM. 4
-
COLLECTOR
b
2
E
A
c
SEATING
PLANE
L
1
D
L
b
e
1
2
3
b
1
H
1
J
1
A
1
e
1
TERM. 4
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.086
0.094
2.19
2.38
-
A
1
b
0.018
0.022
0.46
0.55
3, 4
0.028
0.032
0.72
0.81
3, 4
b
1
b
2
c
0.033
0.040
0.84
1.01
3
0.205
0.215
5.21
5.46
3, 4
0.018
0.022
0.46
0.55
3, 4
D
0.270
0.290
6.86
7.36
-
E
0.250
0.265
6.35
6.73
-
e
0.090 TYP
2.28 TYP
5
e
1
H
1
J
1
L
0.180 BSC
4.57 BSC
5
0.035
0.045
0.89
1.14
-
0.040
0.045
1.02
1.14
6
0.355
0.375
9.02
9.52
-
L
1
0.075
0.090
1.91
2.28
2
NOTES:
1. These dimensions are within allowable dimensions of Rev. C of
JEDEC TO-251AA outline dated 9-88.
2. Solder finish uncontrolled in this area.
3. Dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder plating.
5. Position of lead to be measured 0.250 inches (6.35mm) from bot-
tom of dimension D.
6. Position of lead to be measured 0.100 inches (2.54mm) from bot-
tom of dimension D.
7. Controlling dimension: Inch.
8. Revision 2 dated 10-95.
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