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參數(shù)資料
| 型號： | HI4P0509-5Z96 |
| 廠商： | Intersil |
| 文件頁數(shù)： | 14/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MULTIPLEXER DUAL 4X1 20PLCC |
| 標準包裝： | 1,000 |
| 功能： | 多路復用器 |
| 電路： | 2 x 4:1 |
| 導通狀態(tài)電阻： | 400 歐姆 |
| 電壓電源： | 雙電源 |
| 電壓 - 電源，單路/雙路(±)： | ±15V |
| 電流 - 電源： | 1.5mA |
| 工作溫度： | 0°C ~ 75°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 20-LCC（J 形引線） |
| 供應商設備封裝： | 20-PLCC |
| 包裝： | 散裝 |
21
FN3142.8
October 30, 2007
HI-506, HI-507, HI-508, HI-509
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H
0.25(0.010)
B
M
α
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3859
0.3937
9.80
10.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N16
16
7
α
0°
8°
0°
8°
-
Rev. 1 6/05
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