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參數(shù)資料
| 型號： | HI9P0508-5Z96 |
| 廠商： | Intersil |
| 文件頁數(shù)： | 17/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MULTIPLEXER 8X1 16SOIC |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 功能： | 多路復(fù)用器 |
| 電路： | 1 x 8:1 |
| 導(dǎo)通狀態(tài)電阻： | 400 歐姆 |
| 電壓電源： | 雙電源 |
| 電壓 - 電源，單路/雙路(±)： | ±15V |
| 電流 - 電源： | 1.5mA |
| 工作溫度： | 0°C ~ 75°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 16-SOIC |
| 包裝： | 帶卷 (TR) |
24
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN3142.8
October 30, 2007
HI-506, HI-507, HI-508, HI-509
Plastic Leaded Chip Carrier Packages (PLCC)
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions are
not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
4. To be measured at seating plane
contact point.
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
-C-
A1
A
SEATING
PLANE
0.020 (0.51)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.045 (1.14)
R
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
C
L
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.045 (1.14)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10)
C
-C-
D2/E2
C
L
N28.45 (JEDEC MS-018AB ISSUE A)
28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.165
0.180
4.20
4.57
-
A1
0.090
0.120
2.29
3.04
-
D
0.485
0.495
12.32
12.57
-
D1
0.450
0.456
11.43
11.58
3
D2
0.191
0.219
4.86
5.56
4, 5
E
0.485
0.495
12.32
12.57
-
E1
0.450
0.456
11.43
11.58
3
E2
0.191
0.219
4.86
5.56
4, 5
N28
28
6
Rev. 2 11/97
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HI9P-0508-9 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HI9P0508-9 | 功能描述:IC MULTIPLEXER 8X1 16SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:- 標(biāo)準(zhǔn)包裝:48 系列:- 功能:開關(guān) 電路:4 x SPST - NO 導(dǎo)通狀態(tài)電阻:100 歐姆 電壓電源:單/雙電源 電壓 - 電源，單路/雙路(±):2 V ~ 12 V，±2 V ~ 6 V 電流 - 電源:50nA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:管件 |
| HI9P0508-9Z | 功能描述:多路器開關(guān) IC MUX 8:1 16N IND RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開關(guān)數(shù)量:4 開啟電阻（最大值）:7 Ohms 開啟時間（最大值）: 關(guān)閉時間（最大值）: 傳播延遲時間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16 |
| HI9P0509-5 | 功能描述:IC MULTIPLEXER DUAL 4X1 16SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:- 標(biāo)準(zhǔn)包裝:48 系列:- 功能:開關(guān) 電路:4 x SPST - NO 導(dǎo)通狀態(tài)電阻:100 歐姆 電壓電源:單/雙電源 電壓 - 電源，單路/雙路(±):2 V ~ 12 V，±2 V ~ 6 V 電流 - 電源:50nA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:管件 |
| HI9P0509-5Z | 功能描述:多路器開關(guān) IC W/ANNEAL MUX DIFF 4:1 16N COM RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開關(guān)數(shù)量:4 開啟電阻（最大值）:7 Ohms 開啟時間（最大值）: 關(guān)閉時間（最大值）: 傳播延遲時間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16 |
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