![](http://datasheet.mmic.net.cn/Intersil/HI9P0509-5_datasheet_97439/HI9P0509-5_2.png)
2
FN3142.8
October 30, 2007
Ordering Information
PART NUMBER
PART MARKING
TEMP.
RANGE (°C)
PACKAGE
PKG. DWG. #
HI1-0506-2
HI1-506-2
-55 to +125
28 Ld CERDIP
F28.6
HI1-0506-5
HI1-506-5
0 to +75
28 Ld CERDIP
F28.6
HI4P0506-5
HI4P 506-5
0 to +75
28 Ld PLCC
N28.45
HI4P 506-5Z
0 to +75
28 Ld PLCC (Pb-free)
N28.45
HI9P0506-5
HI9P506-5
0 to +75
28 Ld SOIC
M28.3
HI9P0506-9
HI9P506-9
-40 to +85
28 Ld SOIC
M28.3
HI9P506-9Z
-40 to +85
28 Ld SOIC (Pb-free)
M28.3
HI1-0507-2
HI1-507-2
-55 to +125
28 Ld CERDIP
F28.6
HI3-0507-5
HI3-507-5
0 to +75
28 Ld PDIP
E28.6
HI3-0507-5Z
HI3-507-5Z
0 to +75
28 Ld PDIP (Note
3) (Pb-free) E28.6
HI1-0508-2
HI1-508-2
-55 to 125
16 Ld CERDIP
F16.3
HI1-0508-5
HI1-508
0 to +75
16 Ld CERDIP
F16.3
HI3-0508-5
HI3-508-5
0 to +75
16 Ld PDIP
E16.3
HI3-508-5Z
0 to +75
16 Ld PDIP (Note
3) (Pb-free) E16.3
HI9P0508-5
HI9P508-5
0 to +75
16 Ld SOIC
M16.15
HI9P508-5Z
0 to +75
16 Ld SOIC (Pb-free)
M16.15
HI9P0508-9
HI9P508-9
-40 to +85
16 Ld SOIC
M16.15
HI9P508-9Z
-40 to +85
16 Ld SOIC (Pb-free)
M16.15
HI1-0509-2
HI1-509-2
-55 to +125
16 Ld CERDIP
F16.3
HI1-0509-4
HI1-509-4
-25 to +85
16 Ld CERDIP
F16.3
HI1-0509-5
HI1-509-5
0 to +75
16 Ld CERDIP
F16.3
HI3-0509-5
HI3-509-5
0 to +75
16 Ld PDIP
E16.3
HI4P0509-5
HI4P 509-5
0 to +75
20 Ld PLCC
N20.35
HI4P 509-5Z
0 to +75
20 Ld PLCC (Pb-free)
N20.35
HI9P0509-5
HI9P 509-5
0 to +75
16 Ld SOIC
M16.15
HI9P 509-5Z
0 to +75
16 Ld SOIC (Pb-free)
M16.15
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte
tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC
J STD-020.
3. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
HI-506, HI-507, HI-508, HI-509