3
FN4315.16
November 4, 2005
HIN208EIAZ
(Note)
HIN208EIAZ
-40 to 85 24 Ld SSOP
(Pb-free)
M24.209
HIN208EIAZ-T
(Note)
HIN208EIAZ
24 Ld SSOP Tape and
Reel (Pb-free)
M24.209
HIN208EIB
-40 to 85 24 Ld SOIC
M24.3
HIN208EIBZ
(Note)
HIN208EIBZ
-40 to 85 24 Ld SOIC
(Pb-free)
M24.3
HIN211ECA
0 to 70 28 Ld SSOP
M28.209
HIN211ECA-T
HIN211ECA
28 Ld SSOP Tape and
Reel
M28.209
HIN211ECAZ
(Note)
HIN211ECAZ
0 to 70 28 Ld SSOP
(Pb-free)
M28.209
HIN211ECAZ-T
(Note)
HIN211ECAZ 28 Ld SSOP Tape and
Reel (Pb-free)
M28.209
HIN211ECB
0 to 70 28 Ld SOIC
M28.3
HIN211ECBZ
(Note)
HIN211ECBZ
0 to 70 28 Ld SOIC
(Pb-free)
M28.3
HIN211ECBZ-T
(Note)
HIN211ECBZ 28 Ld SOIC Tape and
Reel (Pb-free)
M28.3
HIN211EIA
-40 to 85 28 Ld SSOP
M28.209
HIN211EIA-T
HIN211EIA
28 Ld SSOP Tape and
Reel
M28.209
HIN211EIAZ
(Note)
HIN211EIAZ
-40 to 85 28 Ld SSOP
(Pb-free)
M28.209
HIN211EIAZ-T
(Note)
HIN211EIAZ
28 Ld SSOP Tape and
Reel (Pb-free)
M28.209
HIN211EIB
-40 to 85 28 Ld SOIC
M28.3
HIN211EIBZ
(Note)
HIN211EIBZ
-40 to 85 28 Ld SOIC
(Pb-free)
M28.3
HIN213ECA
0 to 70 28 Ld SSOP
M28.209
HIN213ECA-T
HIN213ECA
28 Ld SSOP Tape and
Reel
M28.209
HIN213ECAZ
(Note)
HIN213ECAZ
0 to 70 28 Ld SSOP
(Pb-free)
M28.209
HIN213ECAZ-T
(Note)
HIN213ECAZ 28 Ld SSOP Tape and
Reel (Pb-free)
M28.209
HIN213EIA
-40 to 85 28 Ld SSOP
M28.209
HIN213EIA-T
HIN213EIA
28 Ld SSOP Tape and
Reel
M28.209
HIN213EIAZ
(Note)
HIN213EIAZ
-40 to 85 28 Ld SSOP
(Pb-free)
M28.209
HIN213EIAZ-T
(Note)
HIN213EIAZ
28 Ld SSOP Tape and
Reel (Pb-free)
M28.209
HIN213EIB
-40 to 85 28 Ld SOIC
M28.3
HIN213EIBZ
(Note)
HIN213EIBZ
-40 to 85 28 Ld SOIC
(Pb-free)
M28.3
Ordering Information (Continued)
PART NO.
PART
MARKING
TEMP.
RANGE
(°C)
PACKAGE
PKG.
DWG. #
HIN232ECA
0 to 70 16 Ld SSOP
M16.209
HIN232ECA-T
HIN232ECA
16 Ld SSOP Tape and
Reel
M16.209
HIN232ECAZ-T
(Note)
HIN232ECAZ 16 Ld SSOP Tape and
Reel (Pb-free)
M16.209
HIN232ECB
0 to 70 16 Ld SOIC (W) M16.3
HIN232ECB-T
HIN232ECB
16 Ld SOIC (W) Tape and
Reel
M16.3
HIN232ECBN
0 to 70 16 Ld SOIC (N) M16.15
HIN232ECBN-T
HIN232ECBN 16 Ld SOIC (N) Tape and
Reel
M16.15
HIN232ECBNZ
(Note)
232ECBNZ
0 to 70 16 Ld SOIC (N)
(Pb-free)
M16.15
HIN232ECBNZ-T
(Note)
232ECBNZ
16 Ld SOIC (N) Tape and
Reel (Pb-free)
M16.15
HIN232ECBZ
(Note)
232ECBZ
0 to 70 16 Ld SOIC (W)
(Pb-free)
M16.3
HIN232ECBZ-T
(Note)
232ECBZ
16 Ld SOIC (W) Tape and
Reel (Pb-free)
M16.3
HIN232ECP
0 to 70 16 Ld PDIP
E16.3
HIN232ECPZ
(Note)
HIN232ECPZ
0 to 70 16 Ld PDIP*
(Pb-free)
E16.3
HIN232EIBN
-40 to 85 16 Ld SOIC (N) M16.15
HIN232EIBN-T
HIN232EIBN 16 Ld SOIC (N) Tape and
Reel
M16.15
HIN232EIBNZ
(Note)
232EIBNZ
-40 to 85 16 Ld SOIC (N)
(Pb-free)
M16.15
HIN232EIBNZ-T
(Note)
232EIBNZ
16 Ld SOIC (N) Tape and
Reel (Pb-free)
M16.15
HIN232EIV
-40 to 85 16 Ld TSSOP
M16.173
HIN232EIV-T
HIN232EIV
16 Ld TSSOP Tape and
Reel
M16.173
HIN232EIVZ
(Note)
232EIVZ
-40 to 85 16 Ld TSSOP
(Pb-free)
M16.173
HIN232EIVZ-T
(Note)
232EIVZ
16 Ld TSSOP Tape and
Reel (Pb-free)
M16.173
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
Ordering Information (Continued)
PART NO.
PART
MARKING
TEMP.
RANGE
(°C)
PACKAGE
PKG.
DWG. #
HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E