FN4315.16 November 4, 2005 HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E Shrink Small Outline Plastic Packages (SSOP)" />
參數(shù)資料
型號(hào): HIN208EIB
廠商: Intersil
文件頁(yè)數(shù): 14/22頁(yè)
文件大?。?/td> 0K
描述: IC 4DRVR/4RCVR RS232 5V 24-SOIC
標(biāo)準(zhǔn)包裝: 30
類(lèi)型: 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 4/4
規(guī)程: RS232
電源電壓: 4.5 V ~ 5.5 V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 24-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 24-SOIC
包裝: 管件
21
FN4315.16
November 4, 2005
HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess of
“B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H
0.25(0.010)
B
M
α
0.25
0.010
GAUGE
PLANE
A2
M28.209 (JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.390
0.413
9.90
10.50
3
E
0.197
0.220
5.00
5.60
4
e
0.026 BSC
0.65 BSC
-
H
0.292
0.322
7.40
8.20
-
L
0.022
0.037
0.55
0.95
6
N28
28
7
α
-
Rev. 2 6/05
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HIN208EIB-T 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:+/-15kV, ESD-Protected, +5V Powered,RS-232 Transmitters/Receivers
HIN208EIBZ 功能描述:RS-232接口集成電路 RS232 5V 4D/4R 15KV 24 IND RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝:
HIN208EIP 制造商:Rochester Electronics LLC 功能描述:RS232 5V 4D/4R 15KV 24PDIP IND - Bulk 制造商:Intersil Corporation 功能描述:
HIN208IA 制造商:Rochester Electronics LLC 功能描述:- Bulk
HIN208IB 制造商:Rochester Electronics LLC 功能描述:- Bulk