7
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) <VCC < 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . (VCC -0.3V) <V+ < 12V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V)
ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Temperature Range
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
HIN2XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
Thermal Resistance (Typical, Note 1)
θ
JA (°C/W)
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
90
16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . .
110
16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . .
100
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
75
24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
135
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
100
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
(SOIC and SSOP - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = +5V ±10%, (VCC = +5V ±5%, HIN207); C1-C4 = 0.1F;
TA = Operating Temperature Range
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
SUPPLY CURRENTS
Power Supply Current, ICC
No Load,
TA = 25°C
HIN202
-
8
15
mA
HIN206, HIN207, HIN208,
HIN211, HIN213
-11
20
mA
Shutdown Supply Current, ICC(SD)
TA = 25°C
HIN206, HIN211
-
1
10
A
HIN213
-
15
50
A
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, VlL
TIN, EN, SD, EN, SD
--
0.8
V
Input Logic High, VlH
TIN
2.0
-
V
EN, SD, EN, SD
2.4
-
V
Transmitter Input Pullup Current, IP
TIN = 0V
-
15
200
A
TTL/CMOS Receiver Output Voltage Low, VOL
IOUT = 1.6mA
(HIN202, IOUT = 3.2mA)
-0.1
0.4
V
TTL/CMOS Receiver Output Voltage High, VOH
IOUT = -1mA
3.5
4.6
-
V
TTL/CMOS Receiver Output Leakage
EN = VCC, EN = 0, 0V < ROUT < VCC
-0.05
±10
A
RECEIVER INPUTS
RS-232 Input Voltage Range, VIN
-30
-
+30
V
Receiver Input Impedance, RIN
TA = 25°C, VIN = ±3V
3.0
5.0
7.0
k
Receiver Input Low Threshold, VIN (H-L)
VCC = 5V,
TA = 25°C
Active Mode
0.8
1.2
-
V
Shutdown Mode
HIN213 R4 and R5
0.6
1.5
-
V
Receiver Input High Threshold, VIN (L-H)
VCC = 5V,
TA = 25°C
Active Mode
-
1.7
2.4
V
Shutdown Mode
HIN213 R4 and R5
-1.5
2.4
V
Receiver Input Hysteresis, VHYST
VCC = 5V
No Hysteresis in Shutdown Mode
0.2
0.5
1.0
V
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213