參數資料
| 型號： | HIN213EIA-T |
| 廠商： | Intersil |
| 文件頁數： | 6/22頁 |
| 文件大小： | 0K |
| 描述： | IC 4DRVR/5RCVR RS232 5V 28-SSOP |
| 標準包裝： | 1,000 |
| 類型： | 收發(fā)器 |
| 驅動器/接收器數： | 4/5 |
| 規(guī)程： | RS232 |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 28-SSOP（0.209"，5.30mm 寬） |
| 供應商設備封裝： | 28-SSOP |
| 包裝： | 帶卷 (TR) |
14
FN4315.16
November 4, 2005
HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in JE-
DEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and
are measured with the leads constrained to be perpendic-
ular to datum
.
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA
-C-
C
L
E
eA
C
eB
eC
-B-
E1
INDEX
12 3
N/2
N
AREA
SEATING
BASE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
-A-
0.010 (0.25)
C
A
M
BS
E16.3 (JEDEC MS-001-BB ISSUE D)
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8, 10
C
0.008
0.014
0.204
0.355
-
D
0.735
0.775
18.66
19.68
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
6
eB
-
0.430
-
10.92
7
L
0.115
0.150
2.93
3.81
4
N16
16
9
Rev. 0 12/93
相關PDF資料 |
PDF描述 |
|---|---|
| ISL8485EIB | IC TXRX RS-485/422 ESD 8-SOIC |
| ISL8483EIP | IC TXRX RS-485/422 ESD 8-DIP |
| V300B2H100BF2 | CONVERTER MOD DC/DC 2V 100W |
| VI-BWX-MW-F2 | CONVERTER MOD DC/DC 5.2V 100W |
| VE-J3N-MX-F2 | CONVERTER MOD DC/DC 18.5V 75W |
相關代理商/技術參數 |
參數描述 |
|---|---|
| HIN213EIAZ | 功能描述:RS-232接口集成電路 RS232 5V 4D/5R 15KV WAKEUP IND RoHS:否 制造商:Exar 數據速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝: |
| HIN213EIAZ-T | 功能描述:RS-232接口集成電路 RS232 5V 4D/5R 15KV WAKEUP INDEL RoHS:否 制造商:Exar 數據速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝: |
| HIN213EIB | 功能描述:IC 4DRVR/5RCVR RS232 5V 28-SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 驅動器，接收器，收發(fā)器 系列:- 標準包裝:1,000 系列:- 類型:收發(fā)器 驅動器/接收器數:2/2 規(guī)程:RS232 電源電壓:3 V ~ 5.5 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.295"，7.50mm 寬） 供應商設備封裝:16-SOIC 包裝:帶卷 (TR) |
| HIN213EIBZ | 功能描述:RS-232接口集成電路 RS232 5V 4D/5R 15KV WAKEUP 28 IND RoHS:否 制造商:Exar 數據速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝: |
| HIN213IA | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
發(fā)布緊急采購，3分鐘左右您將得到回復。