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參數(shù)資料
| 型號： | HIN232ACP |
| 廠商： | Intersil |
| 文件頁數(shù)： | 4/10頁 |
| 文件大小： | 0K |
| 描述： | IC TXRX RS-232 5V HS 16-DIP |
| 標(biāo)準(zhǔn)包裝： | 25 |
| 類型： | 收發(fā)器 |
| 驅(qū)動器/接收器數(shù)： | 2/2 |
| 規(guī)程： | RS232 |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 16-DIP（0.300"，7.62mm） |
| 供應(yīng)商設(shè)備封裝： | 16-PDIP |
| 包裝： | 管件 |
3
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) <VCC < 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . (VCC -0.3V) <V+ < 12V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V)
ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
ESD Classification . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical, Note 1)
θ
JA (
oC/W)
16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . .
105
16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . .
110
16 Ld PDIP Package*. . . . . . . . . . . . . . . . . . . . . . . .
85
Maximum Junction Temperature (Plastic Package) . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
Operating Conditions
Temperature Range
HIN232ACX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = +5V ±10%, C1-C4 = 0.1F; TA = Operating Temperature Range
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
SUPPLY CURRENTS
Power Supply Current, ICC
No Load, TA = 25
oC-
5
10
mA
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, VlL
TIN
--
0.8
V
Input Logic High, VlH
TIN
2.0
-
V
Transmitter Input Pullup Current, IP
TIN = 0V
-
15
200
A
TTL/CMOS Receiver Output Voltage Low, VOL
IOUT = 3.2mA
-
0.1
0.4
V
TTL/CMOS Receiver Output Voltage High, VOH
IOUT = -1mA
3.5
4.6
-
V
RECEIVER INPUTS
RS-232 Input Voltage Range, VIN
-30
-
+30
V
Receiver Input Impedance, RIN
VIN = ±3V, TA = 25
oC
3.0
5.0
7.0
k
Receiver Input Low Threshold, VIN (H-L)
VCC = 5V, TA = 25
oC-
1.2
-
V
Receiver Input High Threshold, VIN (L-H)
VCC = 5V, TA = 25
oC-
1.7
2.4
V
Receiver Input Hysteresis, VHYST
VCC = 5V
0.2
0.5
1.0
V
TIMING CHARACTERISTICS
Transmitter, Receiver Propagation Delay, tPD
-0.5
10
s
Transition Region Slew Rate, SRT
RL = 3k, CL = 1000pF, Measured from +3V to
-3V or -3V to +3V, (Note 2) 1 Transmitter Switching
320
45
V/
s
TRANSMITTER OUTPUTS
Output Voltage Swing, TOUT
Transmitter Outputs, 3k
to Ground
±5
±9
±10
V
Output Resistance, TOUT
VCC = V+ = V- = 0V, VOUT = ±2V
300
-
RS-232 Output Short Circuit Current, ISC
TOUT Shorted to GND
-
±10
-
mA
ESD PERFORMANCE
RS-232 Pins
(TOUT, RIN)
Human Body Model
-
±15
-
kV
IEC1000-4-2 Contact Discharge
-
±8-
kV
IEC1000-4-2 Air Gap (Note 3)
-
±15
-
kV
All Other Pins
Human Body Model
-
±2-
kV
NOTES:
2. Guaranteed by design.
3. Meets level 4.
HIN232A
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