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參數(shù)資料
| 型號： | HJZ-B-100 |
| 廠商： | MERRIMAC INDUSTRIES INC |
| 元件分類： | 分路器/合路器 |
| 英文描述： | 1 MHz - 200 MHz RF/MICROWAVE SPLITTER AND COMBINER, 0.8 dB INSERTION LOSS |
| 封裝： | HERMETIC |
| 文件頁數(shù)： | 1/1頁 |
| 文件大?。?/td> | 23K |
| 代理商： | HJZ-B-100 |
Key to Pads and Signal State
B - Outline
GENERAL SPECIFICATIONS
Impedance:
50
nom.
Coupling:
-- 3 dB nom.
CW Input:
1 Watt max.
Weight, nominal:
0.007 oz (200 mg)
Operating Temperature: -- 55° to +85°C
PRINCIPAL SPECIFICATIONS
Frequency
Performance
Isolation,
Insertion
Amplitude
Phase
Model
Range,
Bandwidth,
E - H Ports, Loss, dB,
Balance, dB,
Balance,
VSWR,
Number
MHz
dB, Min.
Max.
HJZ-B-100
1 - 200 MHz
2 - 100
30
0.5
0.2
± 3°
1.3:1
1 - 200
20
0.8
0.4
± 5°
1.5:1
HJZ-B-100
0
°/180°POWER DIVIDER / COMBINER
1 to 200 MHz / Symmetrical Phase / High Isolation / Low Insertion Loss / CaseFree Package
Σ
(Sum)
(Delta)
Co-Linear
1
Co-Linear
2
Pad 2
Pad 3
Pad 1
Pad 4
Isol.
In
0° ref.
-- 180°
In
Isol.
0° ref.
0°
For further information contact MERRIMAC / 41 Fairfield Pl., West Caldwell, NJ, 07006 / 973-575-1300 / FAX 973-575-0531
General Notes:
1. The HJZ-B series of 0°/180° hybrid junctions covers
1 to 200 MHz using lumped element technology to
achieve good isolation and balance over wide
bandwidths.
2. These units have been designed for size and
process compatibility with MMIC and similar devices.
In particular, the height of the component is limited to
0.130" so that it can be mounted with other miniature
components in a low profile hermetic housing.
3. The metallized alumina substrate may be attached
to the main ground plane using silver epoxy or solder
while signal leads may be wire bonded, epoxied or
soldered to the gold pads.
4. All units comply with MIL-P-23971 and can be
supplied screened to comply with specifications you
designate for high reliability applications.
NOTES:
1. Tolerance on 3 place decimals
±.010(.25) except as noted.
2. Dimensions in inches over millimeters.
24May96
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