參數(shù)資料
型號: HLMP-BD16-STT00
英文描述: RF/Coaxial Connector; RF Coax Type:BNC; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes
中文描述: 的T 1 3 / 4(5毫米),橢圓形精密光學(xué)性能的AlInGaP和InGaN燈
文件頁數(shù): 5/10頁
文件大?。?/td> 99K
代理商: HLMP-BD16-STT00
5
Package Dimensions
5.00
±
0.20
(0.197
±
0.008)
(31.60
0.70 (0.028)
MAX.
(1.00
8.71
±
0.20
(0.343
±
0.008)
2.54
±
0.38
(0.100
±
0.015)
0.50
±
0.10
(0.020
±
0.004)
SQ. TYP.
CATHODE
LEAD
5.00
±
0.20
(0.197
±
0.008)
(31.60
0.70 (0.028)
MAX.
(1.00
8.71
±
0.20
(0.343
±
0.008)
2.54
±
0.38
(0.100
±
0.015)
0.50
±
0.10
(0.020
±
0.004)
SQ. TYP.
CATHODE
LEAD
1.50
±
0.15
(0.059
±
0.006)
5.00
±
0.20
(0.197
±
0.008)
(31.60
0.70 (0.028)
MAX.
(1.00
8.71
±
0.20
(0.343
±
0.008)
2.54
±
0.38
(0.100
±
0.015)
0.50
±
0.10
(0.020
±
0.004)
SQ. TYP.
CATHODE
LEAD
5.00
±
0.20
(0.197
±
0.008)
(31.60
0.70 (0.028)
MAX.
(1.00
8.71
±
0.20
(0.343
±
0.008)
2.54
±
0.38
(0.100
±
0.015)
0.50
±
0.10
(0.020
±
0.004)
SQ. TYP.
CATHODE
LEAD
1.50
±
0.15
(0.059
±
0.006)
A
B
C
D
11.70– 0.08
0.461– 0.003
)
(
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. LEADS ARE MILD STEEL, SOLDER DIPPED.
3. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN
EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 IN.) DOWN THE LEADS.
4. RECOMMENDED PC BOARD HOLE DIAMETERS:
– LAMP PACKAGES A AND C WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE
OF LAMP PACKAGE = 1.143/1.067 mm (0.044/0.042 IN.).
– LAMP PACKAGES B AND D WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS.
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