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參數(shù)資料
| 型號(hào)： | HMC215LP4E |
| 廠商： | HITTITE MICROWAVE CORP |
| 元件分類： | 混頻器 |
| 英文描述： | 1700 MHz - 4000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 11 dB CONVERSION LOSS-MAX |
| 封裝： | 4 X 4 MM, ROHS COMPLIANT, PLASTIC, SMT, 24 PIN |
| 文件頁數(shù)： | 4/6頁 |
| 文件大?。?/td> | 424K |
| 代理商： | HMC215LP4E |
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
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10 - 4
Harmonics of LO
nLO spur @ rF Port
LO Freq. (GHz)
1
2
3
4
1.0
32
40
27
40
1.4
28
19
25
30
1.8
29
16
30
42
2.2
33
18
27
44
2.6
35
23
34
41
3.0
34
20
41
44
LO = 4 dBm
All values in dBc below input LO level measured at rF port.
Typical Supply Current
Vcc
icc (mA)
+5.0
56 mA
HMC215LP4 / 215LP4E
v01.0111
GaAs MMIC MIXER w/ INTEGRATED
LO AMPLIFIER, 1.7 - 4.0 GHz
Absolute Maximum Ratings
rF / iF input (Vcc= +5V)
+22 dBm
LO Drive (Vcc= +5V)
+10 dBm
BiAs
+7 Vdc
Junction Temperature
150°C
Continuous Pdiss (T = 85°C)
(derate 5.21 mW/°C above 85°C)
0.339 W
Thermal resistance
(junction to ground paddle)
192 °C/W
storage Temperature
-65 to +150°C
Operating Temperature
-40 to +85°C
eLeCTrOsTATiC seNsiTiVe DeViCe
OBserVe HANDLiNG PreCAUTiONs
Outline Drawing
NOTes:
1. LeADFrAMe MATeriAL: COPPer ALLOY
2. DiMeNsiONs Are iN iNCHes [MiLLiMeTers]
3. LeAD sPACiNG TOLerANCe is NON-CUMULATiVe.
4. PAD BUrr LeNGTH sHALL Be 0.15mm MAxiMUM.
PAD BUrr HeiGHT sHALL Be 0.05mm MAxiMUM.
5. PACKAGe WArP sHALL NOT exCeeD 0.05mm.
6. ALL GrOUND LeADs AND GrOUND PADDLe MUsT Be sOLDereD TO PCB rF GrOUND.
7. reFer TO HiTTiTe APPLiCATiON NOTe FOr sUGGesTeD LAND PATTerN.
Part Number
Package Body Material
Lead Finish
MsL rating
Package Marking [3]
HMC215LP4
Low stress injection Molded Plastic
sn/Pb solder
MsL1
[1]
H215
xxxx
HMC215LP4e
roHs-compliant Low stress injection Molded Plastic
100% matte sn
MsL1
[2]
H215
xxxx
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number xxxx
Package Information
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