參數(shù)資料
型號(hào)： HMC629LP4E
廠商： HITTITE MICROWAVE CORP
元件分類(lèi)： 衰減器
英文描述： 0 MHz - 6000 MHz RF/MICROWAVE VARIABLE ATTENUATOR, 5 dB INSERTION LOSS-MAX
封裝： 4 X 4 MM, ROHS COMPLIANT, PLASTIC, LEADLESS, SMT, QFN-24
文件頁(yè)數(shù)： 5/8頁(yè)
文件大?。?/td> 885K
代理商： HMC629LP4E
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
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T
8
8 - 5
Absolute Maximum Ratings
RF Input Power (DC - 6 GHz)
28 dBm (T = +85 °C)
Digital Inputs (Data, Shift Clock,
Latch Enable & Serial Input)
-0.5 to Vdd +0.5V
Bias Voltage (Vdd)
5.6V
Channel Temperature
150 °C
Continuous Pdiss (T = 85 °C)
(derate 10 mW/°C above 85 °C) [1]
0.66 W
Thermal Resistance
98.5 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
HMC629LP4 / 629LP4E
v07.0410
3 dB LSB GaAs MMIC 4-BIT
DIGITAL ATTENUATOR, DC - 6 GHz
Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO PCB DESIGN AND ASSEMBLY FOR QFN PACKAGES
APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking [3]
HMC629LP4
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
H629
XXXX
HMC629LP4E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
MSL1
[2]
H629
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
相關(guān)PDF資料
PDF描述
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