- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄60840 > HMC971 (HITTITE MICROWAVE CORP) 18000 MHz - 40000 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 1.9 dB INSERTION LOSS PDF資料下載
參數(shù)資料
| 型號： | HMC971 |
| 廠商： | HITTITE MICROWAVE CORP |
| 元件分類： | 開關(guān) |
| 英文描述： | 18000 MHz - 40000 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 1.9 dB INSERTION LOSS |
| 封裝： | 2.21 X 1.26 MM, 0.10 MM HEIGHT, DIE-5 |
| 文件頁數(shù)： | 6/6頁 |
| 文件大?。?/td> | 383K |
| 代理商： | HMC971 |
S
w
it
c
h
e
S
-
c
h
ip
7
7 - 6
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
the die should be attached directly to the ground plane eutectically or with
conductive epoxy (see hMc general handling, Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film
substrates are recommended for bringing RF to and from the chip (Figure 1). if
0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be
raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface
of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick
die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then
attached to the ground plane (Figure 2).
Microstrip substrates should be brought as close to the die as possible in order to
minimize bond wire length. typical die-to-substrate spacing is 0.076mm (3 mils).
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective
containers, and then sealed in an eSD protective bag for shipment. Once the
sealed eSD protective bag has been opened, all die should be stored in a dry
nitrogen environment.
Cleanliness: handle the chips in a clean environment. DO NOt attempt to clean
the chip using liquid cleaning systems.
Static Sensitivity: Follow eSD precautions to protect against eSD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied.
Use shielded signal and bias cables to minimize inductive pick-up.
General Handling: handle the chip along the edges with a vacuum collet or with
a sharp pair of bent tweezers. the surface of the chip has fragile air bridges and
should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or
with electrically conductive epoxy. the mounting surface should be clean and flat.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the
perimeter of the chip once it is placed into position. cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire (Dc bias, iF1 and iF2) or Ribbon Bond (RF and LO ports) 0.076
mm x 0.013 mm (3 mil x 0.5 mil) size is recommended. thermosonic wirebonding with a nominal stage temperature of 150 °c and
a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultra-
sonic energy to achieve reliable wirebonds. wirebonds should be started on the chip and terminated on the package or substrate.
All bonds should be as short as possible <0.31 mm (12 mils).
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
RF Ground Plane
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 2.
0.150mm (0.005”) Thick
Moly Tab
HMC971
v00.1210
PIN MMIC HIGH ISOLATION
SPDT SWITCH, 18 - 40 GHz
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HMC995LP5GE | 12000 MHz - 16000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER |
| HMC997LC4 | 17000 MHz - 27000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| HMD16HO-W | 2500 MHz - 2700 MHz BASE STATION/BROADCAST TRANSMISSION ANTENNA, 14 dBi GAIN, 360 deg 3dB BEAMWIDTH |
| HMD16VC-W | 2500 MHz - 2700 MHz BASE STATION/BROADCAST TRANSMISSION ANTENNA, 17 dBi GAIN |
| HMD16HC-W | 2500 MHz - 2700 MHz BASE STATION/BROADCAST TRANSMISSION ANTENNA, 17 dBi GAIN |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HMC972LP5E | 制造商:Hittite Microwave Corp 功能描述:IC AMP VGA ANALOG 32-QFN |
| HMC973ALP3E | 功能描述:IC ATTENUATOR VOLT VAR 16QFN 制造商:analog devices inc. 系列:* 零件狀態(tài):在售 標準包裝:1 |
| HMC973ALP3ETR | 功能描述:RF Attenuator 28dB 500MHz ~ 6GHz 50 Ohm 16-VQFN Exposed Pad, CSP 制造商:analog devices inc. 系列:- 零件狀態(tài):在售 衰減值:28dB 容差:- 頻率范圍:500MHz ~ 6GHz 功率（W）:- 阻抗:50 歐姆 封裝/外殼:16-VQFN 裸露焊盤，CSP 標準包裝:1 |
| HMC973LP3 | 制造商:HITTITE 制造商全稱:Hittite Microwave Corporation 功能描述:GaAs MMIC VOLTAGE-VARIABLE ATTENUATOR, 0.5 - 6.0 GHz |
| HMC973LP3E | 功能描述:ATTENUATOR VOLT VARIABLE 16QFN RoHS:是 類別:RF/IF 和 RFID >> 衰減器 系列:- 標準包裝:1 系列:- 衰減值:- 容差:±1% 頻率范圍:0 ~ 500MHz 功率（瓦特）:2W 阻抗:93 歐姆 封裝/外殼:BNC 單排模塊 |
發(fā)布緊急采購，3分鐘左右您將得到回復。