參數(shù)資料
型號: HS1-1840RH-8
廠商: Harris Corporation
英文描述: Rad-Hard 16 Channel CMOS Analog Rad-Hard 16 Channel CMOS Analog
中文描述: 抗輻射16通道CMOS模擬抗輻射16通道CMOS模擬
文件頁數(shù): 10/13頁
文件大?。?/td> 193K
代理商: HS1-1840RH-8
10
HS-1840RH
Harris - Space Level Product Flow
SEM - Traceable to Diffusion Method 2018, Modified
This device does not meet MIL-STD-883 Method 2018.3 Class
S minimum metal step coverage of 50%. The metal does meet
the intent of the Class S requirement by meeting the current
density requirement of <2E5 A/cm
2
. Calculation based on con-
tinuous current of 10mA. Data can be provided upon request.
Wafer Lot Acceptance Method 5007
Internal Visual Inspection (Note 1)
Gamma Radiation Assurance Tests Method 1019
100% Nondestructive Bond Pull Method 2023
Customer Pre-Cap Visual Inspection (Notes 1, 2)
Temperature Cycling Method 1010 Condition C
Constant Acceleration Method 2001 Y1 30KG
Particle Impact Noise Detection Method 2020,
Condition A 20G
Marking and Serialization
X-Ray Inspection Method 2012
Initial Electrical Tests (T0)
Static Burn-In 72 Hour, +125
o
C (Min) Method 1015
Condition A
Room Temperature Electrical Tests (T1)
Burn-In Delta Calculation (T0-T1)
PDA Calculation 3% Functional
5% Subgroups 1, 7,
Dynamic Burn-In 240 Hours at +125
o
C or equivalent
Method 1015 Condition A
Electrical Tests Subgroups 1, 7, 9 (T2)
Burn-In Delta Calculation (T0 - T2)
PDA Calculation 3% Functional
5% Subgroups 1, 7,
Electrical Test +125
o
C, -55
o
C
Alternate Group A Inspection Method 5005
Fine and Gross Leak Tests Method 1014
Customer Source Inspection (Note 2)
Group B Inspection (Notes 2, 4) Method 5005
Group D Inspection (Notes 2, 4) Method 5005
External Visual Inspection Method 2009
Data Package Generation (Note 3)
NOTES:
1. Visual Inspection is performed to MIL-STD-883 Method 2010, Condition A.
2. These steps are optional, and should be listed on the purchase order if required.
3. Data package contains: Assembly Attributes (post seal)
Test Attributes (includes Group A) -55
o
C, +25
o
C, +125
o
C
Shippable Serial Number List
Radiation Testing Certificate of Conformance
Wafer Lot Acceptance Report (includes SEM report)
X-Ray Report and Film
Test Variables Data, (Table 5 Parameters only)
+25
o
C Initial Test
+25
o
C Interim Test 1
+25
o
C Interim Test 2
+25
o
C Delta Over Burn-In
4. Group B data package contains Attributes Data and Variables Data, (Table 5 Parameters only). Group D data package contains Attributes only.
Harris -8 Product Flow
Internal Visual Inspection, Alternate Condition B (Note 1)
Gamma Radiation Assurance Tests Method 1019
Customer Pre-Cap Visual Inspection (Notes 1, 2)
Temperature Cycling Method 1010 Condition C (50 Cycles)
Constant Acceleration Method 2001 Y1 30kG
Fine and Gross Leak Tests Method 1014
Marking
Initial Electrical Tests (T0)
Dynamic Burn-In 160 Hours, +125
o
C Method 1015 or
Equivalent Condition D
Electrical Tests Subgroups 1, 7, 9 (T1) Method 5004
PDA Calculation 5% Subgroups 1, 7 Method 5004
Electrical Test +125
o
C, -55
o
C Method 5004
Alternate Group A Inspection Method 5005
Customer Source Inspection (Note 2)
Group B Inspection (Notes 2, 4) Method 5005 (Optional)
Group C Inspection (Notes 2, 4) Method 5005 (Optional)
Group D Inspection (Notes 2, 4) Method 5005 (Optional)
External Visual Inspection Method 2009
Data Package Generation (Note 3)
NOTES:
1. Visual inspection is performed to MIL-STD-883 Method 2010, Alternate Condition B.
2. These steps are optional, and should be listed on the purchase order if required.
3. Data Package Contents:
Test Attributes (including Group A) -55
o
C, +25
o
C, +125
o
C
Radiation Testing Certificate of Conformance
4. Group B, C and D data package contains Attributes Data only.
Spec Number
518022
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