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參數(shù)資料
| 型號： | HSI2C-COMPATIBLEMODULE |
| 英文描述： | Evaluation Kit for the HS I2C-Compatible Parts |
| 中文描述： | 評估板協(xié)I2C兼容配件 |
| 文件頁數(shù)： | 6/6頁 |
| 文件大?。?/td> | 260K |
| 代理商： | HSI2C-COMPATIBLEMODULE |
E
2
C
HS I
2
C-Compatible Module
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
6
_____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
2003 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
Figure 5. HS I
2
C-Compatible Module PC Board Layout—Solder Side
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HSI2CMOD | Evaluates: HS I2C-Compatible Parts |
| HSK110 | |
| HSK110 | Silicon Epitaxial Planar Diode for Tuner Band Switch(用于調(diào)諧開關(guān)的平面外延PIN二極管) |
| HSK120 | Silicon Epitaxial Planar Diode for High Speed Switching |
| HSK122 | Silicon Epitaxial Planar Diode for High Voltage Switching |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSI2CMOD | 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Evaluates: HS I2C-Compatible Parts |
| HSI-3861K2013 WAF | 制造商:Harris Corporation 功能描述: |
| HSIB883-BGA | 制造商:IBase Technology (USA) Inc. 功能描述:AC, HEATSINK HAT FOR IB883 BGA, (ROHS) - Bulk |
| HSIB885-BGA | 制造商:IBase Technology (USA) Inc. 功能描述:AC, HEATSINK HAT FOR IB885 BGA, (ROHS) - Bulk |
| HSIB886-BGA | 制造商:IBase Technology (USA) Inc. 功能描述:AC, HEATSINK HAT FOR IB886 BGA, (ROHS) - Bulk |
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