參數(shù)資料
型號(hào): HSM123
文件頁(yè)數(shù): 1/3頁(yè)
文件大?。?/td> 18K
代理商: HSM123
Features
Low capacitance, proof against high voltage.
Fast recovery time.
MPAK package is suitable for high density
surface mounting and high speed assembly.
Ordering Information
Type No.
Laser Mark
Package Code
HSM123
A 9
MPAK
Pin Arrangement
1 Cathode 2
2 Anode 1
3 Cathode 1
Anode 2
(Top View)
2
1
3
ADE-208-027C(Z)
Rev. 3
Aug. 1995
HSM123
Silicon Epitaxial Planar Diode
for High Speed Switching
Absolute Maximum Ratings
**
(Ta = 25°C)
Item
Peak reverse voltage
Reverse voltage
Peak forward current
Symbol
V
RM
V
R
I
FM
I
FSM
*
I
o
T
j
Tstg
Value
85
80
300
4
100
125
-55 to +125
Unit
V
V
mA
A
mA
°C
°C
Non-Repetitive peak forward surge current
Average forward current
Junction temperature
Storage temperature
* Within 1μs forward surge current.
** Per one device
Electrical Characteristics
*
(Ta = 25°C)
Item
Symbol
V
F1
V
F2
V
F3
I
R
C
trr
Min
Typ
0.70
0.79
0.85
1.0
Max
1.0
1.0
1.2
0.1
4.0
3.0
Unit
Test Condition
I
F
= 10 mA
I
F
= 50 mA
I
F
= 100 mA
V
R
= 80 V
V
R
= 0 V, f = 1 MHz
I
F
= 10mA, V
R
=6V, R
L
=50
Forward voltage
V
Reverse current
Capacitance
μA
pF
ns
Reverse recovery time
* Per one device
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