參數(shù)資料
型號(hào): HSM2836C
文件頁(yè)數(shù): 1/3頁(yè)
文件大?。?/td> 18K
代理商: HSM2836C
Features
Fast recovery time.
MPAK package is suitable for high density
surface mounting and high speed assembly.
Ordering Information
Type No.
Laser Mark
Package Code
HSM2836C
A 4
MPAK
Pin Arrangement
1 Cathode
2 Cathode
3 Anode
(Top View)
2
1
3
ADE-208-030B(Z)
Rev. 2
Aug. 1995
HSM2836C
Silicon Epitaxial Planar Diode
for High Speed Switching
Absolute Maximum Ratings
**
(Ta = 25°C)
Item
Peak reverse voltage
Reverse voltage
Peak forward current
Symbol
V
RM
V
R
I
FM
I
FSM
*
I
o
T
j
Tstg
Value
85
80
300
4
100
125
-55 to +125
Unit
V
V
mA
A
mA
°C
°C
Non-Repetitive peak forward surge current
Average forward current
Junction temperature
Storage temperature
* Within 1μs forward surge current.
** Per one device
Electrical Characteristics
*
(Ta = 25°C)
Item
Symbol Min
V
F1
V
F2
V
F3
I
R
C
trr
Typ
0.72
0.83
0.90
2.5
Max
1.0
1.0
1.2
0.1
4.0
20
Unit
Test Condition
I
F
= 10 mA
I
F
= 50 mA
I
F
= 100 mA
V
R
= 80 V
V
R
= 0 V, f = 1 MHz
I
F
= 10mA, V
R
=6V, R
L
=50
Forward voltage
V
Reverse current
Capacitance
Reverse recovery time
μA
pF
ns
* Per one device
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