www.agilent.com/semiconductors
E-mail: SemiconductorSupport@agilent.com
Data subject to change.
Copyright 2002 Agilent Technologies, Inc.
Obsoletes 5988-4385EN
June 14, 2002
5988-7127EN
For product information and a complete list of
Agilent contacts and distributors, please go
Figure 14. Tape dimensions.
Figure 15. Tape leader and trailer dimensions.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
± 0.10 (± 0.004)
PART NUMBER
CATHODE
DIM. B
± 0.10 (± 0.004)
DIM. C
± 0.10 (± 0.004)
HSMx-C172 SERIES 2.40 (0.094) 1.60 (0.063) 1.20 (0.047)
HSMx-C112 SERIES 3.40 (0.134) 1.70 (0.067) 1.20 (0.047)
HSMx-C152 SERIES 3.75 (0.148) 2.10 (0.083) 1.20 (0.047)
HSMx-C192 SERIES 1.80 (0.071) 0.95 (0.037) 0.87 (0.034)
HSMx-C196 SERIES 1.80 (0.071) 0.95 (0.037) 0.75 (0.030)
HSMx-C110
POSITION IN
CARRIER TAPE
DIM. B
(SEE TABLE 1)
DIM. A
(SEE TABLE 1)
R 1.0 ± 0.05
(0.039 ± 0.002)
END
START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS.
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060,
Surface
Mounting SMT LED Indicator
Components
.
Storage Condition:
5 to 30
°
C @ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been open for
more than 1 week
Baking recommended condition:
60
±
5
°
C for 20 hours.