- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄370691 > HSMD-C197 Low Profile ChipLED PDF資料下載
參數(shù)資料
| 型號(hào)： | HSMD-C197 |
| 英文描述： | Low Profile ChipLED |
| 中文描述： | 超薄型ChipLED |
| 文件頁(yè)數(shù)： | 7/10頁(yè) |
| 文件大小： | 210K |
| 代理商： | HSMD-C197 |
7
Figure 5. Relative intensity vs. angle.
Figure 6. Recommended reflow soldering profile.
Figure 7. Recommended soldering pattern for HSMx-C177.
R
100
0
-90
ANGLE
80
60
50
70
20
10
30
40
90
-70
-50
-30
0
20 30
50
70
90
-20
-80
-60
-40
-10
10
40
60
80
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
T
4°C/SEC. MAX.
140-160°C
–3°C/SEC. MAX.
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
CENTERING
BOARD
0.8 (0.031)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
CENTERING
BOARD
Figure 8. Recommended soldering pattern for HSMx-C197.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
Figure 4. Maximum forward current vs.
ambient temperature.
Figure 3. Luminous intensity vs. forward current.
0
5
15
I
F
– FORWARD CURRENT – mA
0
0.4
1.0
L
(
20
0.6
0.2
0.8
10
30
1.4
25
1.2
AS AMBER
AS ORANGE, RED,
and DEEP RED
0
5
15
I
F
– FORWARD CURRENT – mA
0
0.4
1.0
L
(
20
0.6
0.2
0.8
10
25
1.2
GaP
InGaN
0
0
20
60
80
100
5
I
F
T
A
– AMBIENT TEMPERATURE – °C
40
15
30
10
20
InGaN
25
AlInGaP
10
30
50
70
90
GaP
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HSMG-C177 | Low Profile ChipLED |
| HSMG-C197 | Low Profile ChipLED |
| HSML-C177 | Low Profile ChipLED |
| HSML-C197 | Low Profile ChipLED |
| HSMT-C197 | Low Profile ChipLED |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSMD-C220 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Agilent HSMD-C220 High Performance ChipLED |
| HSMD-C260 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Surface Mount Chip LEDs |
| HSMD-C265 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Reverse Mount ChipLED |
| HSMD-C650 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Surface Mount Chip LEDs |
| HSMD-C660 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Right Angle Surface Mount Chip LEDs |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。