參數(shù)資料
型號(hào): HSMF-C655
英文描述: Surface Mount Chip LEDs(表貼型芯片LED)
中文描述: 表面貼裝芯片發(fā)光二極管(表貼型芯片發(fā)光二極管)
文件頁數(shù): 7/8頁
文件大?。?/td> 214K
代理商: HSMF-C655
7
Figure 10. Tape Dimensions.
Figure 11. Tape Leader and Trailer Dimensions.
END
START
THERE SHALL BE A
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
150 mm-360 mm
(5.9 - 14.2 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
1.30 ± 0.10
(0.051 ± 0.004)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 ± 0.10
(0.157 ± 0.004)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.10
(0.157 ± 0.004)
1.50 + 0.10
0
(0.059 + 0.004)
0
HSMx-C650 SERIES 3.75 (0.148) 2.10 (0.083)
HSMx-C670 SERIES 2.40 (0.094) 1.60 (0.064)
HSMF-C655
3.70 (0.146) 3.15 (0.124)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004)
DIM. B
± 0.10 (0.004)
PART NUMBER
Storage Condition: 5 to 30 C @ 60% RH max.
Baking is required under the condition:
a) the blue silica gel indicator becoming white/transparent color
b) the pack has been opened for more than 1 week
Baking recommended condition: 60 +/– 5C for 20 hours.
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