參數資料
型號: HSMJ-L640
英文描述: Surface Mount Lensed High Performance Chip LEDs(表貼型高性能LED芯片)
中文描述: 表面貼裝透鏡高性能的芯片發(fā)光二極管(表貼型高性能發(fā)光二極管芯片)
文件頁數: 7/8頁
文件大?。?/td> 154K
代理商: HSMJ-L640
7
Figure 11. Tape Leader and Trailer Dimensions.
Figure 9. Reel Dimensions.
Figure 10. Tape Dimensions.
2 ± 0.5
11.4 ± 1.0
9 ± 0.3
60– 0
13.0 ± 0.2
21 ± 0.8
180– 3
END
START
THERE SHALL BE A
MINIMUM OF 40 mm
OF EMPTY COMPONENT
POCKETS SEALED WITH
COVER TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 40 mm
OF EMPTY COMPONENT
POCKETS SEALED WITH
COVER TAPE.
150 mm-360 mm
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
4 ± 0.1
1.8
2 ± 0.05
4 ± 0.1
1.7 ± 0.1
0.2 ± 0.05
3.35 ± 0.1
3.5 ± 0.05
1.75 ± 0.1
8 ± 0.3
1.5+0
CATHODE
CENTER HOLE
USER DIRECTION
OF FEED
Storage Condition: 5 to 30 C
@ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 +/– 5C for 20 hours.
相關PDF資料
PDF描述
HSML-L640 Surface Mount Lensed High Performance Chip LEDs(表貼型高性能LED芯片)
HSMA-S660 SMT Right Angle S660
HSMA-S670 SMT Top Mount S670
HSMA-S690 SMT Top Mount S690
HSMC-L640 SMT Top Mount ChipLED L640
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