參數(shù)資料
型號: HSML-C177
英文描述: Low Profile ChipLED
中文描述: 超薄型ChipLED
文件頁數(shù): 9/10頁
文件大?。?/td> 210K
代理商: HSML-C177
9
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060,
Surface
Mounting SMT LED Indicator
Components
.
Storage Condition:
5 to 30
°
C @ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been open for
more than 1 week
Baking recommended condition:
60
±
5
°
C for 20 hours.
Figure 11. Tape dimensions.
Figure 12. Tape leader and trailer dimensions.
END
START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
± 0.10 (± 0.004)
PART NUMBER
CATHODE
DIM. B
± 0.10 (± 0.004)
DIM. C
± 0.10 (± 0.004)
HSMx-C177 SERIES 2.40 (0.094) 1.60 (0.063) 0.65 (0.025)
HSMx-C197 SERIES 1.80 (0.071) 0.95 (0.037) 0.60 (0.024)
相關(guān)PDF資料
PDF描述
HSML-C197 Low Profile ChipLED
HSMT-C197 Low Profile ChipLED
HSMY-C177 Low Profile ChipLED
HSMY-C197 Low Profile ChipLED
HSMA-C177 Low Profile ChipLED
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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