參數(shù)資料
型號(hào)： HSMN-A101-N8YJ1
英文描述： Surface Mount LED Indicator
中文描述： 表面貼裝LED指示燈
文件頁(yè)數(shù)： 9/13頁(yè)
文件大小： 121K
代理商： HSMN-A101-N8YJ1
9
Figure 8a. Recommended SnPb reflow soldering profile.
240
°
C MAX.
20 SEC. MAX.
3
°
C/SEC.
MAX.
120 SEC. MAX.
TIME
T
183
°
C
100-150
°
C
–
6
°
C/SEC.
MAX.
60-150 SEC.
3
°
C/SEC. MAX.
Figure 7. Radiation Pattern.
N
1.0
0
-90
ANGULAR DISPLACEMENT
–
DEGREES
0.8
0.6
0.2
0.4
-70
-50
-30
0
20 30
50
70
90
-20
-80
-60
-40
-10
10
40
60
80
Figure 9. Recommended wave soldering profile.
D
F
°
C
-0.3
-100
TEMPERATURE
–
°
C
0.5
0.4
0.2
0.1
0
-0.2
150
50
-50
0
100
-0.1
0.3
GaP/AlGaAs/
AlInGaP
InGaN/GaN
Figure 6. Forward voltage shift vs. temperature.
Figure 8b. Recommended Pb-free reflow soldering profile.
217
°
C
MAX. 120 SEC.
6
°
C/SEC. MAX.
3
°
C/SEC. MAX.
125
°
C ± 25
°
C
255
°
C
60 to 150 SEC.
10 to 20 SEC.
TIME
T
* THE TIME FROM 25
°
C TO PEAK TEMPERATURE = 6 MINUTES MAX.
+5
°
C
-0
°
C
LAMINAR WAVE
HOT AIR KNIFE
BOTTOM SIDE
TOP SIDE OF
TURBULENT WAVE
FLUXING
PREHEAT
0
10
20
30
50
100
150
200
250
30
40
50
TIME
–
SECONDS
T
–
°
C
60
70
80
90
100
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150
C (100
C PCB)
SOLDER WAVE TEMPERATURE = 245
°
C
AIR KNIFE AIR TEMPERATURE = 390
C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
Figure 10. Recommended soldering pad pattern.
2.60
4.50
1.50
SOLDER RESIST
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