參數(shù)資料
型號(hào): HSMT-C265
英文描述: AlInGaP chipLED
中文描述: 鋁銦鎵磷化物chipLED環(huán)保
文件頁數(shù): 5/5頁
文件大小: 264K
代理商: HSMT-C265
Agilent Technologies reserves the right to alter prices, specifications, features, capabilities, functions, release dates, and remove availability of the
product(s) at anytime.
5
Figure 3: Tape Dimensions
THERE SHALL BE A MINIMUM OF
160mm (6.3in.) OF EMPTY
COMPONENT POCKETS SEALED
WITH COVER TAPE.
MOUNTED WITH
COMPONENTS.
THERE SHALL BE A MINIMUM OF
160mm (6.3in.) OF EMPTY
COMPONENT POCKETS SEALED
WITH COVER TAPE.
MINIMUM OF
230mm
(9.05in.) MAY
CONSIST OF
CARRIER
AND/OR
COVER TAPE
END
START
Convective IR Reflow
Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060,
Surface Mounting SMT LED
Indicator Components
.
Storage Condition : 5
to 30
O
C @ 60%RH max.
Baking is required under
the condition :
a) the
blue
indicator
white
/
color
b) the pack has been open
for more than 1 week
Baking recommended
condition : 60 ± 5
O
C for
20 hrs
silica
gel
becoming
transparent
Figure 4: Tape Leader and Trailer Dimensions.
Notes:
1. All dimensions in millimeters (inches).
2.
www.semiconductor.agilent.com
Data subject to change.
Copyright 2003 Agilent Technologies, Inc.
Revision Date: xx-xx-xxxx
Tolerance is
±
0.1 mm (
±
0.004 in.) unless otherwise specified.
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