參數(shù)資料
型號: HSMx-C260
英文描述: Surface Mount Chip LEDs(表貼型芯片LED)
中文描述: 表面貼裝芯片發(fā)光二極管(表貼型芯片發(fā)光二極管)
文件頁數(shù): 2/7頁
文件大小: 192K
代理商: HSMX-C260
2
Package Dimensions
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is
±
0.1 mm (
±
0.004 in.) unless otherwise specified.
Absolute Maximum Ratings at T
A
=25
°
C
Parameter
DC Forward Current
[1]
Peak Pulsing Current
[2]
Power Dissipation
Reverse Voltage (I
R
= 100
μ
A)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
HSMx-C260
25
100
65
5
95
-25 to +80
-30 to +85
Units
mA
mA
mW
V
°
C
°
C
°
C
See IR soldering profile (Figure 6)
Notes:
1. Derate linearly as shown in Figure 4 for temperature above 25
°
C.
2. Pulse condition of 1/10 duty and 0.1 msec. width.
HSMx-C260
3.4 (0.134)
0.3 (0.012)
0.50 ± 0.15
(0.020 ± 0.006)
1.1 (0.043)
POLARITY
CATHODE
MARK
1.1 (0.043)
0.50 ± 0.15
(0.020 ± 0.006)
1.2 (0.047)
1.25 (0.049)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
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