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參數(shù)資料
| 型號： | HSMx-C660 |
| 英文描述： | Right Angle Surface Mount Chip LEDs(直角表面封裝LED) |
| 中文描述： | 直角表面貼裝芯片LED（直角表面封裝發(fā)光二極管） |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 188K |
| 代理商： | HSMX-C660 |
5
Figure 10. Tape Dimensions.
DIM. A
±
0.10 (0.004)
3.35
DIM. B
±
0.10 (0.004)
2.30
Part Number
HSMx-C660
Figure 11. Tape Leader and Trailer Dimensions.
END
START
THERE SHALL BE A
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
150 mm-360 mm
(5.9 - 14.2 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
1.20
0.20
DIM. B
(SEE TABLE)
4.00 ± 0.10
(0.157 ± 0.004)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.10
(0.157 ± 0.004)
1.50 + 0.10
0
(0.059 + 0.004)
0
CATHODE
1.1
Storage Condition: 5 to 30 C @ 60% RH max.
Baking is required under the condition:
a) the blue silica gel indicator becoming white/transparent color
b) the pack has been opened for more than 1 week
Baking recommended condition: 60 +/– 5C for 20 hours.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HSMX-S660 | High Performance Surface Mount Chip LEDs |
| HSMX-S670 | High Performance Surface Mount Chip LEDs |
| HSMX-S690 | High Performance Surface Mount Chip LEDs |
| HSMx-S660 | High Performance Surface Mount Chip LEDs(高性能表貼型芯片LED) |
| HSMx-S670 | High Performance Surface Mount Chip LEDs(高性能表貼型芯片LED) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSMX-C670 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Surface Mount Chip LEDs |
| HSMX-H670 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Surface Mount Flip Chip LEDs |
| HSMX-H690 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Surface Mount Flip Chip LEDs |
| HSMX-S660 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:High Performance Surface Mount Chip LEDs |
| HSMX-S670 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:High Performance Surface Mount Chip LEDs |
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