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2
Absolute Maximum Ratings
T
A
= 25
o
C, Unless Otherwise Specified
HUF76131SK8
30
30
±
16
UNITS
V
V
V
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
DSS
Drain to Gate Voltage (R
GS
= 20k
) (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
GS
Drain Current
Continuous (Figure 2) (Notes 2, 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
DM
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
AS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Derate Above 25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
J
, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
L
Package Body for 10s, See Techbrief 334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
pkg
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
10
Figure 5
Figure 6
2.5
0.02
-55 to 150
A
W
W/
o
C
o
C
300
260
o
C
o
C
NOTE:
1. T
J
= 25
o
C to 150
o
C.
Electrical Specifications
PARAMETER
Drain to Source Breakdown Voltage
Gate to Source Threshold Voltage
Zero Gate Voltage Drain Current
T
A
= 25
o
C, Unless Otherwise Specified
SYMBOL
BV
DSS
V
GS(TH)
I
DSS
TEST CONDITIONS
MIN
30
1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TYP
-
-
-
-
-
0.017
0.015
0.011
-
15
61
33
36
-
39
22
1.53
4.00
9.50
1605
685
115
-
-
-
MAX
-
-
1
250
±
100
0.018
0.017
0.013
115
-
-
-
-
105
47
26
1.85
-
-
-
-
-
50
143.4
177.3
UNITS
V
V
μ
A
μ
A
nA
ns
ns
ns
ns
ns
ns
nC
nC
nC
nC
nC
pF
pF
pF
o
C/W
o
C/W
o
C/W
I
D
= 250
μ
A, V
GS
= 0V (Figure 11)
V
GS
= V
DS
, I
D
= 250
μ
A (Figure 10)
V
DS
= 25V, V
GS
= 0V
V
DS
= 25V, V
GS
= 0V, T
A
= 150
o
C
V
GS
=
±
16V
I
D
= 10A, V
GS
= 4.5V (Figures 9,14)
I
D
= 10A, V
GS
= 5V
I
D
= 10A, V
GS
= 10V
V
DD
= 15V, I
D
10A, R
L
= 1.5
, V
GS
=
5V,
R
GS
= 6.8
(Figure 15)
Gate to Source Leakage Current
Drain to Source On Resistance
I
GSS
r
DS(ON)
Turn-On Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-Off Time
Total Gate Charge
Gate Charge at 5V
Threshold Gate Charge
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Thermal Resistance Junction to Ambient
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Q
g(TOT)
Q
g(5)
Q
g(TH)
Q
gs
Q
gd
C
ISS
C
OSS
C
RSS
R
θ
JA
V
GS
= 0V to 10V V
DD
= 15V, I
D
10A,
R
L
= 1.5
,
I
g(REF)
= 1.0mA
(Figure 13)
V
GS
= 0V to 1V
V
GS
= 0V to 5V
V
DS
= 25V, V
GS
= 0V, f = 1MHz
(Figure 12)
Pad Area = 0.76 in
2
(Note 2)
Pad Area = 0.054 in
2
(See TB377)
Pad Area = 0.0115 in
2
(See TB377)
Source to Drain Diode Specifications
PARAMETER
Source to Drain Diode Voltage
SYMBOL
V
SD
TEST CONDITIONS
MIN
-
-
-
-
TYP
-
-
-
-
MAX
1.25
1.1
57
81
UNITS
V
V
ns
nC
I
SD
= 10A
I
SD
= 2.3A
I
SD
= 2.3A, dI
SD
/dt = 100A/
μ
s
I
SD
= 2.3A, dI
SD
/dt = 100A/
μ
s
Reverse Recovery Time
Reverse Recovered Charge
NOTES:
2. 50
o
C/W measured using FR-4 board with 0.76 in
2
footprint at 10 seconds.
3. 177.3
o
C/W measured using FR-4 board with 0.0115 in
2
footprint at 1000 seconds.
t
rr
Q
RR
HUF76131SK8