參數(shù)資料
型號: HY29LV160BF-90
廠商: HYNIX SEMICONDUCTOR INC
元件分類: DRAM
英文描述: 16 Mbit (2M x 8/1M x 16) Low Voltage Flash Memory
中文描述: 1M X 16 FLASH 2.7V PROM, 90 ns, PBGA48
封裝: 8 X 9 MM, FBGA-48
文件頁數(shù): 9/48頁
文件大?。?/td> 517K
代理商: HY29LV160BF-90
9
Rev. 1.2/May 01
HY29LV160
Write Operation
Certain operations, including programming data
and erasing sectors of memory, require the host
to write a command or command sequence to the
HY29LV160. Writes to the device are performed
by placing the byte or word address on the device
s
address inputs while the data to be written is input
on DQ[15:0] (BYTE# = High) or DQ[7:0] (BYTE#
= Low). The host system must drive the CE# and
WE# pins Low and drive OE# High for a valid write
operation to take place. All addresses are latched
on the falling edge of WE# or CE#, whichever
happens later. All data is latched on the rising edge
of WE# or CE#, whichever happens first.
The
Device Commands
section of this data sheet
provides details on the specific device commands
implemented in the HY29LV160.
Standby Operation
When the system is not reading or writing to the
device, it can place the HY29LV160 in the Standby
mode. In this mode, current consumption is greatly
reduced, and the data bus outputs are placed in
the high impedance state, independent of the OE#
input. The Standby mode can be invoked using
two methods.
The device enters the CE# Deep Standby mode
when the CE# and RESET# pins are both held at
V
CC
± 0.3V. Note that this is a more restricted
voltage range than V
IH
. If both CE# and RESET#
are held at V
IH
, but not within V
CC
± 0.3V, the de-
vice will be in the CE# Normal Standby mode, but
the standby current will be greater.
The device enters the RESET# Deep Standby
mode when the RESET# pin is held at V
SS
± 0.3V.
If RESET# is held at V
IL
but not within V
SS
± 0.3V,
the device will be in the RESET# Normal Standby
mode, but the standby current will be greater. See
Reset Operation for additional information.
The device requires standard access time (t
CE
) for
read access when the device is in either of the
standby modes, before it is ready to read data. If
the device is deselected during erasure or pro-
gramming, it continues to draw active current until
the operation is completed.
Sleep Mode
The sleep mode automatically minimizes device
power consumption. This mode is automatically
entered when addresses remain stable for t
ACC
+
30 ns (typical) and is independent of the state of
the CE#, WE#, and OE# control signals. Stan-
dard address access timings provide new data
when addresses are changed. While in sleep
mode, output data is latched and always available
to the system.
NOTE:
Sleep mode is entered only when the device is
in read mode. It is not entered if the device is executing
an automatic algorithm, if it is in erase suspend mode,
or during receipt of a command sequence.
Output Disable Operation
When the OE# input is at V
IH
, output data from the
device is disabled and the data bus pins are placed
in the high impedance state.
Reset Operation
The RESET# pin provides a hardware method of
resetting the device to reading array data. When
the RESET# pin is driven low for the minimum
specified period, the device immediately termi-
nates any operation in progress, tri-states the data
bus pins, and ignores all read/write commands for
the duration of the RESET# pulse. The device also
resets the internal state machine to reading array
data. If an operation was interrupted by the as-
sertion of RESET#, it should be reinitiated once
the device is ready to accept another command
sequence to ensure data integrity.
Current is reduced for the duration of the RESET#
pulse as described in the Standby Operation sec-
tion above.
If RESET# is asserted during a program or erase
operation, the RY/BY# pin remains Low (busy) until
the internal reset operation is complete, which re-
quires a time of t
READY
(during Automatic Algo-
rithms). The system can thus monitor RY/BY# to
determine when the reset operation completes,
and can perform a read or write operation t
RB
after
RY/BY# goes High. If RESET# is asserted when
a program or erase operation is not executing (RY/
BY# pin is High), the reset operation is completed
within a time of t
RP
. In this case, the host can per-
form a read or write operation t
RH
after the RE-
SET# pin returns High .
The RESET# pin may be tied to the system reset
signal. Thus, a system reset would also reset the
device, enabling the system to read the boot-up
firmware from the Flash memory.
相關(guān)PDF資料
PDF描述
HY29LV160TF-90 16 Mbit (2M x 8/1M x 16) Low Voltage Flash Memory
HY29LV160BF-70I 16 Mbit (2M x 8/1M x 16) Low Voltage Flash Memory
HY29LV160BF-80I 16 Mbit (2M x 8/1M x 16) Low Voltage Flash Memory
HY29LV160BF-90I ECONOLINE: RKZ - Safety standards and approvals: EN 60950 certified, rated for 250VAC (LVD test report)- Custom Solutions Available- 3kVDC & 4kVDC Isolation- UL94V-0 Package Material- Power Sharing on Output- Efficiency to 84%
HY29LV160BT-80 16 Mbit (2M x 8/1M x 16) Low Voltage Flash Memory
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HY29LV160BF-90I 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:16 Mbit (2M x 8/1M x 16) Low Voltage Flash Memory
HY29LV160BT-12 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:16 Mbit (2M x 8/1M x 16) Low Voltage Flash Memory
HY29LV160BT-12I 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:16 Mbit (2M x 8/1M x 16) Low Voltage Flash Memory
HY29LV160BT-70 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:16 Mbit (2M x 8/1M x 16) Low Voltage Flash Memory
HY29LV160BT-70I 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:16 Mbit (2M x 8/1M x 16) Low Voltage Flash Memory