參數(shù)資料
型號: HYS64T128021HDL-5-A
廠商: INFINEON TECHNOLOGIES AG
英文描述: 200-Pin Small Outline Dual-In-Line Memory Module
中文描述: 200引腳小外型雙列內存模組
文件頁數(shù): 18/48頁
文件大?。?/td> 1168K
代理商: HYS64T128021HDL-5-A
HYS64T[32000/64020/128021][G/H]DL–[3.7/5]–A
512 Mbit DDR2 SDRAM
Electrical Characteristics
Data Sheet
18
Rev. 0.91, 2004-06
09122003-FTXN-KM26
3
Electrical Characteristics
Table 9
Parameter
Absolute Maximum Ratings
Symbol
Limit Values
Min.
– 0.5
– 1.0
– 0.5
+69
5
Unit
Note/Test
Condition
Max.
2.3
2.3
2.3
+105
95
Voltage on any pins relative to
V
SS
Voltage on
V
DD
relative to
V
SS
Voltage on
V
DD Q
relative to
V
SS
Barometric Pressure (operating & storage)
Storage Humidity (without condensation)
V
IN
,
V
OUT
V
DD
V
DDQ
V
V
1)
1) Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions above
those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect reliability.
1)
1)
kPa
%
1)
H
STG
1)
Table 10
Parameter
Operating Temperature Range
Symbol
Limit Values
min.
0
0
– 55
+69
10
Unit
Notes
max.
+65
+95
+100
+105
90
DIMM Module Operating Temperature Range (ambient)
DRAM Component Case Temperature Range
Storage temperature
Barometric Pressure (operating & storage)
Operating Humidity (relative)
T
OPR
T
CASE
T
STG
°C
°C
°C
kPa
%
1)2)3)4)
1) DRAM Component Case Temperature is the surface temperature in the center on the top side of any of the DRAMs. For
measurement conditions, please refer to the JEDEC document JESD51-2
2) Within the DRAM Component Case Temperature Range all DRAM specifications will be supported
3) Above 85
°
C DRAM case temperature the Auto-Refresh command interval has to be reduced to
t
REFI
= 3.9
μ
s.
4) Self-Refresh period is hard-coded in the DRAMs and therefore it is imperative that the system ensures the DRAM is below
85
°
C case temperature before initiating self-refresh operation.
5) Up to 3000 m.
5)
H
OPR
Table 11
Parameter
Supply Voltage Levels and DC Operating Conditions
Symbol
Limit Values
Min.
1.7
1.7
0.49
×
V
DDQ
1.7
V
REF
+ 0.125
– 0.30
– 5
Unit
Notes
Nom.
1.8
1.8
0.5
×
V
DDQ
Max.
1.9
1.9
0.51
×
V
DDQ
3.6
V
DDQ
+0.3
V
REF
–0.125
5
Device Supply Voltage
Output Supply Voltage
Input Reference Voltage
SPD Supply Voltage
DC Input Logic High
DC Input Logic Low
In / Output Leakage Current
V
DD
V
DDQ
V
REF
V
DDSPD
V
IH (DC)
V
IL (DC)
I
L
V
V
V
V
V
V
μ
A
1)
1) Under all conditions,
V
DDQ
must be less than or equal to
V
DD
2) Peak to peak AC noise on
V
REF
may not exceed ± 2%
V
REF
(DC).
V
REF
is also expected to track noise variations in
V
DDQ
.
3) For any pin on the DIMM connector under test input of 0 V
V
IN
V
DDQ
+ 0.3 V.
2)
3)
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