參數(shù)資料
型號: HYS64T64020HM-37-A
廠商: INFINEON TECHNOLOGIES AG
英文描述: Double-Data-Rate-Two SDRAM Micro-DIMM
中文描述: 雙數(shù)據(jù)速率- 2 SDRAM的微型DIMM
文件頁數(shù): 20/31頁
文件大?。?/td> 955K
代理商: HYS64T64020HM-37-A
Preliminary
HYS64T[3200/6402]0[H/K/L]M–[3.7/5]–A
Double-Data-Rate-Two SDRAM Micro-DIMM
I
DD
Specifications and Conditions
Data Sheet
20
Rev. 0.6, 2004-06
03242004-2CBE-IJ2X
4.1
I
DD
Test Conditions
For testing the
I
DD
parameters, the timing parameters as in
Table 14
are used.
4.2
ODT (On Die Termination) Current
The ODT function adds additional current consumption
to the DDR2 SDRAM when enabled by the EMRS(1).
Depending on address bits A[6,2] in the EMRS(1) a
“weak” or “strong” termination can be selected. The
current consumption for any terminated input pin,
depends on the input pin is in tri-state or driving “0” or
“1”, as long a ODT is enabled during a given period of
time.
Note:For power consumption calculations the ODT duty cycle has to be taken into account
Table 14
Parameter
IDD Measurement Test Condition
Symbol
-3.7
-5
Unit
PC2-4200-4-4-4
4
3.75
15
60
PC2-3200-3-3-3
3
5
15
60
CAS Latency
Clock Cycle Time
Active to Read or Write delay
Active to Active / Auto-Refresh command
period
Active bank A to Active bank B command
delay
Active to Precharge Command
Precharge Command Period
Auto-Refresh to Active / Auto-Refresh
command period
Average periodic Refresh interval
CL
min
t
CKmin
t
RCDmin
t
RCmin
t
CK
ns
ns
ns
t
RRDmin
10
10
ns
t
RASmin
t
RPmin
t
RFCmin
45
15
105
45
15
105
ns
ns
ns
t
REFI
7.8
7.8
μ
s
Table 15
Parameter
ODT current per terminated pin
Symbol min.
typ.
max. Unit
EMRS(1) State
Enabled ODT current per DQ
ODT is HIGH; Data Bus inputs are FLOATING
I
ODTO
5
2.5
10
5
6
3
12
6
7.5
3.75
15
7.5
mA/DQ A6 = 0, A2 = 1
mA/DQ A6 = 1, A2 = 0
mA/DQ A6 = 0, A2 = 1
mA/DQ A6 = 1, A2 = 0
Active ODT current per DQ
ODT is HIGH; worst case of Data Bus inputs
are STABLE or SWITCHING.
I
ODTT
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