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參數(shù)資料
| 型號(hào)： | HYS64V64220GU-8-C2 |
| 廠商： | INFINEON TECHNOLOGIES AG |
| 英文描述： | 3.3 V 64M x 64/72-Bit, 512MByte SDRAM Modules 168-pin Unbuffered DIMM Modules |
| 中文描述： | 3.3伏6400 x 64/72-Bit，512MByte SDRAM內(nèi)存模塊168針腳無緩沖DIMM模塊 |
| 文件頁數(shù)： | 1/15頁 |
| 文件大?。?/td> | 105K |
| 代理商： | HYS64V64220GU-8-C2 |
INFINEON Technologies
1
9.01
HYS 64/72V64220GU
SDRAM-Modules
3.3 V 64M x 64/72-Bit, 512MByte SDRAM Modules
168-pin Unbuffered DIMM Modules
Description
The HYS 64V64220GU and HYS 72V64220GU are industry standard 168-pin 8-byte Dual in-line
Memory Modules (DIMMs) which are organized as 64M
×
64 and 64M
×
72 in two banks high speed
memory arrays designed with 256M Synchronous DRAMs (SDRAMs) for non-parity and ECC
applications. The DIMMs use “-7” speed sorted 256 Mbit Synchronous DRAMs (SDRAMs) to meet
the PC133-222 requirements, “-7.5” for PC133-333 and “-8” components for PC100-222
applications. Decoupling capacitors are mounted on the PC board. The PC board design is
according to INTEL’s module specification. The DIMMs have a serial presence detect, implemented
with a serial E
2
PROM using the 2-pin I
2
C protocol. The first 128 bytes are utilized by the DIMM
manufacturer and the second 128 bytes are available to the end user. All Infineon 168-pin DIMMs
provide a high performance, flexible 8-byte interface in a 133.35 mm long footprint, with 1.25“
(31.75 mm) height.
168-pin unbuffered 8 Byte Dual-In-Line
SDRAM Modules for PC main memory
applications using 256Mbit technology.
PC100-222, PC133-333 & PC133-222
versions
Two bank 64M
×
64 and 64M
×
72
organization
Optimized for byte-write non-parity and ECC
applications
JEDEC standard Synchronous DRAMs
(SDRAM)
Programmed Latencies:
Single + 3.3 V (
±
0.3 V) power supply
Programmable CAS Latency, Burst Length,
and Wrap Sequence (Sequential &
Interleave)
Auto Refresh (CBR) and Self Refresh
Decoupling capacitors mounted on substrate
All inputs and outputs are LVTTL compatible
Serial Presence Detect with E
2
PROM
Uses Infineon 256 Mbit SDRAM components
in 32M
×
8 organization and TSOPII-54
packages
Fully PC board layout compatible to INTEL’s
Rev. 1.0 module specification
Gold contact pad, card size:
133.35 mm
×
31.75 mm
×
4.00 mm
(JEDEC MO-161-BA)
Product Speed
CL
t
RCD
2
t
RP
2
-7
PC133
2
-7.5
PC133
3
3
3
-8
PC100
2
2
2
SDRAM Performance:
-7
-7.5
-8
Unit
PC133
PC133
PC100
f
CK
t
AC
Clock Frequency (max.)
133
133
100
MHz
Clock Access time
5.4
5.4
6
ns
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HYS72V64220GU | 3.3 V 64M x 64/72-Bit, 512MByte SDRAM Modules 168-pin Unbuffered DIMM Modules |
| HYS72V64220GU-7.5-C2 | SDRAM|64MX72|CMOS|DIMM|168PIN|PLASTIC |
| HYS72V64220GU-7.5-D | SDRAM|64MX72|CMOS|DIMM|168PIN|PLASTIC |
| HYS72V64220GU-8 | 3.3 V 16M x 64/72-Bit SDRAM Modules 3.3 V 32M x 64/72-Bit SDRAM Modules 3.3 V 64M x 64/72-Bit SDRAM Modules |
| HZ(H)SERIES | |
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| HYS64V8000GCDL-8 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x64 SDRAM Module |
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