參數(shù)資料
型號(hào): IBM0164405P
廠商: IBM Microeletronics
英文描述: 16M x 4 13/11 EDO DRAM(16M x 4 動(dòng)態(tài)RAM(超頁(yè)面模式并帶24條地址線,其中13條為行地址選通,11條為列地址選通))
中文描述: 1,600 × 4 13/11 EDO公司的DRAM(1,600 × 4動(dòng)態(tài)隨機(jī)存儲(chǔ)器(超頁(yè)面模式并帶24條地址線,其中13條為行地址選通,11條為列地址選通))
文件頁(yè)數(shù): 10/29頁(yè)
文件大?。?/td> 1309K
代理商: IBM0164405P
IBM0164405B
IBM0164405P
16M x 4 13/11 EDO DRAM
IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
Page 10 of 29
88H2007
GA14-4252-01
Revised 4/97
Self Refresh Cycle
- Low Power Version Only
Symbol
Parameter
-50
-60
Units
Notes
Min.
Max.
Min.
Max.
t
RASS
RAS Pulse Width
During Self Refresh Cycle
100
100
μ
s
1
t
RPS
RAS Precharge Time
During Self Refresh Cycle
84
104
ns
1
t
CHS
CAS Hold Time
During Self Refresh Cycle
-50
-50
ns
1
1. When using Self Refresh mode, the following refresh operations must be performed to ensure proper DRAM operation:
If row addresses are being refreshed in an EVENLY DISTRIBUTED manner over the refresh interval using CBR refresh cycles,
then only one CBR cycle must be performed immediately after exit from Self Refresh.
If row addresses are being refreshed in any other manner (ROR- Distributed/Burst; or CBR-Burst) over the refresh interval, then a
full set of row refreshes must be performed immediately before entry to and immediately after exit from Self Refresh.
Refresh Cycle
Symbol
Parameter
-50
-60
Units
Notes
Min.
Max.
Min.
Max.
t
CSR
CAS Setup Time
(CAS before RAS Refresh Cycle)
5
5
ns
t
CHR
CAS Hold Time
(CAS before RAS Refresh Cycle)
5
10
ns
t
WRP
WE Setup Time
(CAS before RAS Refresh Cycle)
5
10
ns
t
WRH
WE Hold Time
(CAS before RAS Refresh Cycle)
5
10
ns
t
RPC
RAS Precharge to CAS Hold Time
5
5
ns
t
REF
Refresh Period
SP version
64
64
ms
1
LP version
256
256
1. 8192 cycles for RAS Only Refresh; 4096 cycles for CBR Refresh.
Discontinued (12/98 - last order; 3/99 last ship)
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IBM0165405P 16M x 4 12/12 EDO DRAM(16M x 4 動(dòng)態(tài)RAM(超頁(yè)面模式并帶24條地址線,其中12條為行地址選通,12條為列地址選通))
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