參數(shù)資料
型號(hào)： IBM25EMPPC740LEBE466
元件分類： 32位微控制器
英文描述： 32-Bit Microprocessor
中文描述： 32位微處理器
文件頁數(shù)： 3/50頁
文件大?。?/td> 516K
代理商： IBM25EMPPC740LEBE466
5/20/99
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
Page iii
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
Table of Contents
Preface .....................................................................................................................................................1
Overview ...................................................................................................................................................1
Features ...................................................................................................................................................3
General Parameters .................................................................................................................................6
Electrical and Thermal Characteristics .....................................................................................................7
DC Electrical Characteristics ................................................................................................................7
AC Electrical Characteristics ..................................................................................................................11
Clock AC Specifications ......................................................................................................................11
60x Bus Input AC Specifications .........................................................................................................12
60x Bus Output AC Specifications ......................................................................................................14
L2 Clock AC Specifications .................................................................................................................16
L2 Bus Input AC Specifications ...........................................................................................................18
L2 Bus Output AC Specifications ........................................................................................................19
IEEE 1149.1 AC Timing Specifications ..................................................................................................20
PowerPC 740 Microprocessor Pin Assignments ....................................................................................22
PowerPC 740 Microprocessor Pinout Listings .......................................................................................23
PowerPC 740 Package ..........................................................................................................................26
Mechanical Dimensions of the 255 CBGA Package ...........................................................................27
PowerPC 750 Microprocessor Pin Assignments ....................................................................................28
PowerPC 750 Package ..........................................................................................................................32
Mechanical Dimensions of the 360 CBGA Package........................................................................... 33
System Design Information ....................................................................................................................35
PLL Configuration ...............................................................................................................................35
PLL Power Supply Filtering .................................................................................................................36
Decoupling Recommendations ...........................................................................................................36
Connection Recommendations ...........................................................................................................36
Output Buffer DC Impedance ..............................................................................................................37
Pull-up Resistor Requirements ...........................................................................................................38
Thermal Management Information ......................................................................................................39
Internal Package Conduction Resistance ...........................................................................................40
Heat Sink Selection Example ..............................................................................................................43
Ordering Information ...............................................................................................................................45
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