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參數(shù)資料

型號：	IBM25EMPPC750LDBE3330
元件分類：	微控制器/微處理器
英文描述：	32-BIT, 333 MHz, RISC PROCESSOR, CBGA360
封裝：	25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁數(shù)：	23/50頁
文件大?。?/td>	600K
代理商：	IBM25EMPPC750LDBE3330

5/20/99

Version 1.51

PowerPC 740 and PowerPC 750 Datasheet

Page iii

PowerPC 740 and PowerPC 750 Embedded Microprocessor

IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L

Table of Contents

Preface ..................................................................................................................................................... 1

Overview ................................................................................................................................................... 1

Features ................................................................................................................................................... 3

General Parameters ................................................................................................................................. 6

Electrical and Thermal Characteristics ..................................................................................................... 7

DC Electrical Characteristics ................................................................................................................ 7

AC Electrical Characteristics .................................................................................................................. 11

Clock AC Specifications ...................................................................................................................... 11

60x Bus Input AC Specifications ......................................................................................................... 12

60x Bus Output AC Specifications ...................................................................................................... 14

L2 Clock AC Specifications ................................................................................................................. 16

L2 Bus Input AC Specifications ........................................................................................................... 18

L2 Bus Output AC Specifications ........................................................................................................ 19

IEEE 1149.1 AC Timing Specifications .................................................................................................. 20

PowerPC 740 Microprocessor Pin Assignments .................................................................................... 22

PowerPC 740 Microprocessor Pinout Listings ....................................................................................... 23

PowerPC 740 Package .......................................................................................................................... 26

Mechanical Dimensions of the 255 CBGA Package ........................................................................... 27

PowerPC 750 Microprocessor Pin Assignments .................................................................................... 28

PowerPC 750 Package .......................................................................................................................... 32

Mechanical Dimensions of the 360 CBGA Package ........................................................................... 33

System Design Information .................................................................................................................... 35

PLL Configuration ............................................................................................................................... 35

PLL Power Supply Filtering ................................................................................................................. 36

Decoupling Recommendations ........................................................................................................... 36

Connection Recommendations ........................................................................................................... 36

Output Buffer DC Impedance .............................................................................................................. 37

Pull-up Resistor Requirements ........................................................................................................... 38

Thermal Management Information ...................................................................................................... 39

Internal Package Conduction Resistance ........................................................................................... 40

Heat Sink Selection Example .............................................................................................................. 43

Ordering Information ............................................................................................................................... 45

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相關(guān)代理商/技術(shù)參數(shù)	參數(shù)描述
IBM25EMPPC750LEBA300	制造商:未知廠家制造商全稱:未知廠家功能描述:32-Bit Microprocessor
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IBM25EMPPC750LEBA366	制造商:未知廠家制造商全稱:未知廠家功能描述:32-Bit Microprocessor
IBM25EMPPC750LEBA400	制造商:未知廠家制造商全稱:未知廠家功能描述:32-Bit Microprocessor
IBM25EMPPC750LEBA466	制造商:未知廠家制造商全稱:未知廠家功能描述:32-Bit Microprocessor

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