參數(shù)資料
型號: IBM25PPC740L-GB366A2T
英文描述: MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
中文描述: 微處理器| 32位|的CMOS | BGA封裝| 255PIN |陶瓷
文件頁數(shù): 26/50頁
文件大小: 516K
代理商: IBM25PPC740L-GB366A2T
Page 22
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
5/20/99
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
PowerPC 740 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the PowerPC 740, a 255 pin ceramic ball grid array
(BGA) package.
Figure 13 (in part A) shows the pinout of the 255 CBGA package as viewed from the top surface. Part B
shows the side profile of the 255 CBGA package to indicate the direction of the top surface view.
Figure 13. Pinout of the PowerPC 740 BGA Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Not to Scale
Substrate Assembly.
Encapsulation
View
Part B
Die
Part A
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IBM25PPC740L-GB400A2R 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
IBM25PPC740L-GB400A2T 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
IBM25PPC740L-GB433A2R 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC