參數(shù)資料
型號(hào): IBM25PPC740L-GB400A2T
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 400 MHz, RISC PROCESSOR, CBGA255
封裝: 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁(yè)數(shù): 38/48頁(yè)
文件大?。?/td> 608K
代理商: IBM25PPC740L-GB400A2T
12/8/99
Version 1.02
Page 43
PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20
m Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors.
Dow-Corning Corporation
517-496-4000
Dow-Corning Electronic Materials
P.O. Box 0997
Midland, MI 48686-0997
Figure 22. Thermal Performance of Select Thermal Interface Material
Specic
Ther
mal
Resistance
(Kin
2 /W)
0
0.5
1
1.5
2
0
10
20
30
40
50
60
70
80
Contact Pressure (PSI)
+
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
+
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