參數(shù)資料
型號(hào)： IBM25PPC740L-GB466A2T
英文描述： MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
中文描述： 微處理器| 32位|的CMOS | BGA封裝| 255PIN |陶瓷
文件頁(yè)數(shù)： 43/50頁(yè)
文件大?。?/td> 516K
代理商： IBM25PPC740L-GB466A2T
5/20/99
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
Page 39
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
Thermal Management Information
This section provides thermal management information for the CBGA package for air cooled applications.
Proper thermal control design is primarily dependent upon the system-level design; that is, the heat sink, air
flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be attached
to the package by several methods: adhesive, spring clip to holes in the printed-circuit board or package, and
mounting clip and screw assembly, see Figure 20.
Figure 20. Package Exploded Cross-Sectional View with Several Heat Sink Options
Maximum Heatsink Weight Limit for the 360 CBGA
Force
Maximum (pounds)
Dynamic Compression
10.0
Dynamic Tensile
2.5
Static Constant (Spring Force)
8.2
CBGA Package
Heat Sink
Heat Sink clip
Adhesive
or
Thermal
Interface
Material
Printed
Circuit
Board
Option
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參數(shù)描述
IBM25PPC740L-GB500A2R 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC
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IBM25PPC750CXEJP2013T 制造商:IBM Microelectronics 功能描述:MPU 750XX RISC 32BIT 0.18UM 400MHZ 1.8V/2.5V 256BGA - Trays 制造商:IBM 功能描述:IBM IBM25PPC750CXEJP2013T Co-Processors
IBM25PPC750CXEJP5512T 制造商:IBM 功能描述:
IBM25PPC750CXEJP7012T 制造商:IBM Microelectronics 功能描述:MPU 750XX RISC 32BIT 0.18UM 600MHZ 1.8V/2.5V 256BGA - Trays 制造商:IBM 功能描述:IBM IBM25PPC750CXEJP7012T Co-Processors
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