參數(shù)資料
型號(hào)： IBM25PPC750CX-CP30-3T
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, 433 MHz, RISC PROCESSOR, PBGA256
封裝： PLASTIC, BGA-256
文件頁(yè)數(shù)： 30/44頁(yè)
文件大?。?/td> 562K
代理商： IBM25PPC750CX-CP30-3T
PowerPC 750CX RISC Microprocessor Datasheet
Page 36
Version 1.1
November 13, 2000
7.6
Thermal Management Information
This section provides thermal management information for the PBGA package for air cooled applications. Proper ther-
mal control design is primarily dependent upon the system-level design and air ow.
7.7
Heat Sink Considerations
The PowerPC 750CX RISC Microprocessor package will support a maximum normal load of 2.2 kilograms. This load
includes the heat sink and any forces used to position or fasten the heat sink.
7.8
Internal Package Conduction Resistance
For the PBGA, described in Table 3 on page 12, the primary intrinsic conduction thermal resistance paths are as follows.
Die junction-to-case thermal resistance
Die junction-to-lead thermal resistance
Die junction-to-ambient thermal resistance
Figure 18 depicts the primary heat transfer path for this package.
Figure 17. IBM RISCWatchTM JTAG to HRESET, TRST, and SRESET Signal Connector
HRESET from RISCWatch
System HRESET
HRESET to PowerPC 750CX
TRST to PowerPC 750CX
SRESET to PowerPC 750CX
SRESET from RISCWatch
System SRESET
TRST from RISCWatch
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