- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄67682 > IBM25PPC750L-GB400A2T 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 PDF資料下載
參數(shù)資料
| 型號： | IBM25PPC750L-GB400A2T |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
| 封裝： | 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件頁數(shù)： | 40/48頁 |
| 文件大?。?/td> | 608K |
| 代理商： | IBM25PPC750L-GB400A2T |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁當(dāng)前第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁
12/8/99
Version 1.02
Page 45
PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20
m Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
Assuming an air velocity of 0.5m/s, we have an effective
θ
SA of 7
°C/W, thus
T
J = 30
°C + 5°C + (.03°C/W +1.0°C/W + 7°C/W) × 4.5W,
resulting in a junction temperature of approximately 71
°C which is well within the maximum operating temper-
ature of the component.
Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Aavid, and Wakefield Engineering offer different
heat sink-to-ambient thermal resistances, and may or may not need air flow.
Though the junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure-of-
merit used for comparing the thermal performance of various microelectronic packaging technologies, one
should exercise caution when only using this metric in determining thermal management because no single
parameter can adequately describe three-dimensional heat flow. The final chip-junction operating tempera-
ture is not only a function of the component-level thermal resistance, but the system-level design and its oper-
ating conditions. In addition to the component's power dissipation, a number of factors affect the final
operating die-junction temperature. These factors might include air flow, board population (local heat flux of
adjacent components), heat sink efficiency, heat sink attach, next-level interconnect technology, system air
temperature rise, etc.
Figure 23. Thermalloy #2328B Pin-Fin Heat Sink-to-Ambient Thermal Resistance vs. Air ow Velocity
Approach Air Velocity (m/s)
Heat
Sink
Ther
mal
Resistance
(
×°
C/W)
1
2
3
4
5
6
7
8
0
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin-n Heat Sink
(25 x 28 x 15 mm)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| IBM25PPC750-DB0M2500 | 32-BIT, 250 MHz, RISC PROCESSOR, CBGA360 |
| IBM25PPC750CX-CP30-3T | 32-BIT, 433 MHz, RISC PROCESSOR, PBGA256 |
| IBM25PPC750CX-CP40-3T | 32-BIT, 466 MHz, RISC PROCESSOR, PBGA256 |
| IBM25PPC750CXEFP10-3T | RISC PROCESSOR, PBGA256 |
| IBM25PPC750CXEJP7012T | 32-BIT, 600 MHz, RISC PROCESSOR, PBGA256 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IBM25PPC750L-GB400C2R | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| IBM25PPC750L-GB400C2SR | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| IBM25PPC750L-GB400C2ST | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| IBM25PPC750L-GB400C2T | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| IBM25PPC750L-GB400D2R | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。