FN4900.9 February 27, 2006 ICL3225E, ICL3227E, ICL3245E Small Outline Plastic Packages (SOIC) α NOTES: 1. Symbols are defined in the “MO" />
參數(shù)資料
型號: ICL3225ECA-T
廠商: Intersil
文件頁數(shù): 11/20頁
文件大?。?/td> 0K
描述: IC 2DRVR/2RCVR RS232 3V 20-SSOP
標準包裝: 1,000
類型: 收發(fā)器
驅動器/接收器數(shù): 2/2
規(guī)程: RS232
電源電壓: 3 V ~ 5.5 V
安裝類型: 表面貼裝
封裝/外殼: 20-SSOP(0.209",5.30mm 寬)
供應商設備封裝: 20-SSOP
包裝: 帶卷 (TR)
19
FN4900.9
February 27, 2006
ICL3225E, ICL3227E, ICL3245E
Small Outline Plastic Packages (SOIC)
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H
0.25(0.010)
B
M
M28.3 (JEDEC MS-013-AE ISSUE C)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.6969
0.7125
17.70
18.10
3
E
0.2914
0.2992
7.40
7.60
4
e
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.01
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N28
28
7
α
0o
8o
0o
8o
-
Rev. 0 12/93
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