FN4910.21 February 22, 2010 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Thin Shrink Small Outline Plastic Packages (TSSOP) NOTES" />
參數(shù)資料
型號(hào)： ICL3232ECV-16T
廠商： Intersil
文件頁數(shù)： 18/33頁
文件大小： 0K
描述： IC 2DRVR/2RCVR RS232 3V 16-TSSOP
標(biāo)準(zhǔn)包裝： 2,500
類型： 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù)： 2/2
規(guī)程： RS232
電源電壓： 3 V ~ 5.5 V
安裝類型： 表面貼裝
封裝/外殼： 16-TSSOP（0.173"，4.40mm 寬）
供應(yīng)商設(shè)備封裝： 16-TSSOP
包裝： 帶卷 (TR)
25
FN4910.21
February 22, 2010
ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E
Thin Shrink Small Outline Plastic Packages (TSSOP)
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AB, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M
-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.15mm (0.006
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact. (Angles in degrees)
α
INDEX
AREA
E1
D
N
12
3
-B-
0.10(0.004)
C A
M
BS
e
-A-
b
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
c
E
0.25(0.010)
B
M
L
0.25
0.010
GAUGE
PLANE
A2
0.05(0.002)
M16.173
16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.043
-
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.033
0.037
0.85
0.95
-
b
0.0075
0.012
0.19
0.30
9
c
0.0035
0.008
0.09
0.20
-
D
0.193
0.201
4.90
5.10
3
E1
0.169
0.177
4.30
4.50
4
e
0.026 BSC
0.65 BSC
-
E
0.246
0.256
6.25
6.50
-
L
0.020
0.028
0.50
0.70
6
N16
16
7
α
0o
8o
0o
8o
-
Rev. 1 2/02
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ICL3232ECV-16-T 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:+,-15kV ESD Protected, +3V to +5.5V, 1Microamp, 250kbps, RS-232 Transmitters/Receivers
ICL3232ECV-16Z 功能描述:RS-232接口集成電路 RS232 3V 2D/2R 15KV COM RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝:
ICL3232ECV-16Z 制造商:Intersil Corporation 功能描述:Transceiver IC
ICL3232ECV-16Z-T 功能描述:RS-232接口集成電路 RS232 3V 2D/2R 15KV COM RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝:
ICL3232ECV-16Z-T7A 功能描述:RS-232接口集成電路 RS232 3V 2D/2R 15KV COM RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝:
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