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鍙冩暩(sh霉)璩囨枡
| 鍨嬭櫉锛� | ICL3245ECVZ-T |
| 寤犲晢锛� | Intersil |
| 鏂囦欢闋佹暩(sh霉)锛� | 6/20闋� |
| 鏂囦欢澶�?銆�?/td> | 0K |
| 鎻忚堪锛� | IC 3DRVR/5RCVR RS232 3V 28-TSSOP |
| 妯欐簴鍖呰锛� | 2,500 |
| 椤炲瀷锛� | 鏀剁櫦(f膩)鍣� |
| 椹呭嫊鍣�/鎺ユ敹鍣ㄦ暩(sh霉)锛� | 3/5 |
| 瑕�(gu墨)绋嬶細 | RS232 |
| 闆绘簮闆诲锛� | 3 V ~ 5.5 V |
| 瀹夎椤炲瀷锛� | 琛ㄩ潰璨艰 |
| 灏佽/澶栨锛� | 28-TSSOP锛�0.173"锛�4.40mm 瀵級 |
| 渚涙噳鍟嗚ō鍌欏皝瑁濓細 | 28-TSSOP |
| 鍖呰锛� | 甯跺嵎 (TR) |
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14
FN4900.9
February 27, 2006
Human Body Model (HBM) Testing
As the name implies, this test method emulates the ESD
event delivered to an IC during human handling. The tester
delivers the charge through a 1.5k
current limiting resistor,
making the test less severe than the IEC61000 test which
utilizes a 330
limiting resistor. The HBM method
determines an ICs ability to withstand the ESD transients
typically present during handling and manufacturing. Due to
the random nature of these events, each pin is tested with
respect to all other pins. The RS-232 pins on 鈥淓鈥� family
devices can withstand HBM ESD events to
卤15kV.
IEC61000-4-2 Testing
The IEC61000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-232 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The lower
current limiting resistor coupled with the larger charge
storage capacitor yields a test that is much more severe than
the HBM test. The extra ESD protection built into this
device鈥檚 RS-232 pins allows the design of equipment
meeting level 4 criteria without the need for additional board
level protection on the RS-232 port.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the
IC pin until the voltage arcs to it. The current waveform
delivered to the IC pin depends on approach speed,
humidity, temperature, etc., so it is difficult to obtain
repeatable results. The 鈥淓鈥� device RS-232 pins withstand
卤15kV air-gap discharges.
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than
卤8kV. All 鈥淓鈥� family devices survive 卤8kV contact
discharges on the RS-232 pins.
Typical Performance Curves VCC = 3.3V, TA = 25掳C
FIGURE 15. TRANSMITTER OUTPUT VOLTAGE vs LOAD
CAPACITANCE
FIGURE 16. SLEW RATE vs LOAD CAPACITANCE
-6
-4
-2
0
2
4
6
1000
2000
3000
4000
5000
0
LOAD CAPACITANCE (pF)
TRAN
S
M
ITTER
OUTPUT
V
O
L
T
A
G
E
(V)
1 TRANSMITTER AT 1Mbps
VOUT+
VOUT-
OTHER TRANSMITTERS AT 30kbps
LOAD CAPACITANCE (pF)
SL
EW
R
A
TE
(V
/
s)
0
1000
2000
3000
4000
5000
0
10
30
50
110
-SLEW
+SLEW
70
90
ICL3225E, ICL3227E, ICL3245E
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| ICL3245EIA | 鍔熻兘鎻忚堪:IC 3DRVR/5RCVR RS232 3V 28-SSOP RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 鎺ュ彛 - 椹呭嫊鍣�锛屾帴鏀跺櫒锛屾敹鐧�(f膩)鍣� 绯诲垪:- 鐢�(ch菐n)鍝佸煿瑷撴ā濉�:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 妯欐簴鍖呰:25 绯诲垪:- 椤炲瀷:鏀剁櫦(f膩)鍣� 椹呭嫊鍣�/鎺ユ敹鍣ㄦ暩(sh霉):2/2 瑕�(gu墨)绋�:RS232 闆绘簮闆诲:4.5 V ~ 5.5 V 瀹夎椤炲瀷:閫氬瓟 灏佽/澶栨:16-DIP锛�0.300"锛�7.62mm锛� 渚涙噳鍟嗚ō鍌欏皝瑁�:16-PDIP 鍖呰:绠′欢 |
| ICL3245EIA-T | 鍔熻兘鎻忚堪:IC 3DRVR/5RCVR RS232 3V 28-SSOP RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 鎺ュ彛 - 椹呭嫊鍣紝鎺ユ敹鍣�锛屾敹鐧�(f膩)鍣� 绯诲垪:- 鐢�(ch菐n)鍝佸煿瑷撴ā濉�:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 妯欐簴鍖呰:25 绯诲垪:- 椤炲瀷:鏀剁櫦(f膩)鍣� 椹呭嫊鍣�/鎺ユ敹鍣ㄦ暩(sh霉):2/2 瑕�(gu墨)绋�:RS232 闆绘簮闆诲:4.5 V ~ 5.5 V 瀹夎椤炲瀷:閫氬瓟 灏佽/澶栨:16-DIP锛�0.300"锛�7.62mm锛� 渚涙噳鍟嗚ō鍌欏皝瑁�:16-PDIP 鍖呰:绠′欢 |
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| ICL3245EIAZ-T | 鍔熻兘鎻忚堪:RS-232鎺ュ彛闆嗘垚闆昏矾 W/ANNEAL RS232 3V 3D /5R 15KV 1MBPS E-DWN RoHS:鍚� 鍒堕€犲晢:Exar 鏁�(sh霉)鎿�(j霉)閫熺巼:52 Mbps 宸ヤ綔闆绘簮闆诲:5 V 闆绘簮闆绘祦:300 mA 宸ヤ綔婧害鑼冨湇:- 40 C to + 85 C 瀹夎棰ㄦ牸:SMD/SMT 灏佽 / 绠遍珨:LQFP-100 灏佽: |
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