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參數(shù)資料
型號(hào): ICS840001BGI-25LFT
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 12/12頁
文件大?。?/td> 0K
描述: IC CLOCK GEN FIBRE CHAN 8-TSSOP
標(biāo)準(zhǔn)包裝: 2,500
系列: HiPerClockS™, FemtoClock™
類型: 時(shí)鐘發(fā)生器
PLL:
輸入: LVCMOS,LVTTL
輸出: LVCMOS,LVTTL
電路數(shù): 1
比率 - 輸入:輸出: 1:1
差分 - 輸入:輸出: 無/無
頻率 - 最大: 170MHz
除法器/乘法器: 是/無
電源電壓: 2.375 V ~ 3.465 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 8-TSSOP
包裝: 帶卷 (TR)
其它名稱: 840001BGI-25LFT
IDT / ICS LVCMOS CLOCK GENERATOR
9
ICS840001BGI-25 REV. A MARCH 31, 2009
ICS840001I-25
FEMTOCLOCK LVCMOS/LVTTL CLOCK GENERATOR
TABLE 5. THERMAL RESISTANCE
θθθθθ
JA
FOR
8-LEAD TSSOP, FORCED CONVECTION
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 1meter per second and a multi-layer board, the appropriate value is 125.5°C/W per Table 5.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.316W * 125.5°C/W = 124.7°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow, and
the type of board (multi-layer).
θθθθθ
JA
by Velocity (Meters Per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
129.5°C/W
125.5°C/W
123.5°C/W
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