IDT / ICS HCSL CLOCK GENERATOR 12 " />
參數(shù)資料
型號: ICS841608AKILF
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 4/17頁
文件大小: 0K
描述: IC CLOCK GENERATOR 32VFQFPN
產品培訓模塊: PCI-Express
標準包裝: 490
系列: HiPerClockS™, FemtoClock™
類型: 時鐘發(fā)生器,扇出配送,多路復用器
PLL: 帶旁路
輸入: LVCMOS,LVTTL,晶體
輸出: HCSL
電路數(shù): 1
比率 - 輸入:輸出: 2:8
差分 - 輸入:輸出: 無/是
頻率 - 最大: 125MHz
除法器/乘法器: 是/無
電源電壓: 3.135 V ~ 3.465 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 32-VFQFN 裸露焊盤
供應商設備封裝: 32-VFQFPN 裸露焊盤(4x4)
包裝: 托盤
其它名稱: 841608AKILF
ICS841608AKILF-ND
IDT / ICS HCSL CLOCK GENERATOR
12
ICS841608AKI REV. A JUNE 18, 2008
ICS841608I
FEMTOCLOCKS CRYSTAL-TO-HCSL CLOCK GENERATOR
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS841608I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS841608I is the sum of the core power plus the analog power plus the power dissipated in the
load(s). The following is the power dissipation for V
DD
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
DD_MAX
* (I
DD_MAX
+ I
DDA_MAX
) = 3.465V * (87mA + 15mA) = 353.43mW
Power (outputs)
MAX
= 44.5mW/Loaded Output pair
If all outputs are loaded, the total power is 8 * 44.5mW = 356mW
Total Power
_MAX
(3.465V, with all outputs switching) = 353.43mW + 356mW =709.43mW
2.
Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in Section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air
flow and a multi-layer board, the appropriate value is 37°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.709W * 37°C/W = 111.2°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 7. THERMAL RESISTANCE
θθθθθ
JA
FOR
32-PIN VFQFN, FORCED CONVECTION
θθθθθ
JA
vs. Air Flow (Meters per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
37.0°C/W
32.4°C/W
29.0°C/W
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