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參數(shù)資料
| 型號(hào)： | ICS8523BGT |
| 廠商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分類： | 時(shí)鐘及定時(shí) |
| 英文描述： | 8523 SERIES, LOW SKEW CLOCK DRIVER, 4 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO20 |
| 封裝： | 6.50 X 4.40 MM, 0.92 MM HEIGHT, MS-153, TSSOP-20 |
| 文件頁數(shù)： | 3/17頁 |
| 文件大?。?/td> | 449K |
| 代理商： | ICS8523BGT |
8523BG
www.icst.com/products/hiperclocks.html
REV. D SEPTEMBER 13, 2004
11
Integrated
Circuit
Systems, Inc.
ICS8523
LOW SKEW, 1-TO-4
DIFFERENTIAL-TO-HSTL FANOUT BUFFER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8523.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8523 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX = VDD_MAX * IDD_MAX = 3.465V * 50mA = 173.3mW
Power (outputs)
MAX = 32.6mW/Loaded Output pair
If all outputs are loaded, the total power is 4 * 32.6mW = 130.4mW
Total Power
_MAX (3.465V, with all outputs switching) = 173.3mW + 130.4mW = 303.7mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.304W * 66.6°C/W = 90.2°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θθθθθ
JA by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
114.5°C/W
98.0°C/W
88.0°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
73.2°C/W
66.6°C/W
63.5°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
20-PIN TSSOP, FORCED CONVECTION
ICS8523
LOW SKEW, 1-TO-4 DIFFERENTIAL-TO-HSTL FANOUT BUFFER
TSD
IDT / ICS LOW SKEW, 1-TO-4 DIFFERENTIAL-TO-HSTL FANOUT BUFFER
ICS8523
11
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