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    參數(shù)資料
    型號: ICS85320AMI
    英文描述: LVCMOS / LVTTL-TO-DIFFERENTIAL 2.5V / 3.3V LVPECL TRANSLATOR
    中文描述: 的LVCMOS / LVTTL至差分為2.5V / 3.3V的LVPECL的譯者
    文件頁數(shù): 10/14頁
    文件大?。?/td> 198K
    代理商: ICS85320AMI
    85320AMI
    www.icst.com/products/hiperclocks.html
    REV. A AUGUST 25, 2004
    10
    Integrated
    Circuit
    Systems, Inc.
    ICS85320I
    LVCMOS / LVTTL-
    TO
    -D
    IFFERENTIAL
    2.5V / 3.3V LVPECL T
    RANSLATOR
    P
    OWER
    C
    ONSIDERATIONS
    This section provides information on power dissipation and junction temperature for the ICS85320I.
    Equations and example calculations are also provided.
    1. Power Dissipation.
    The total power dissipation for the ICS85320I is the sum of the core power plus the power dissipated in the load(s).
    The following is the power dissipation for V
    = 3.3V + 5% = 3.465V, which gives worst case results.
    NOTE:
    Please refer to Section 3 for details on calculating power dissipated in the load.
    Power (core)
    MAX
    = V
    CC_MAX
    * I
    EE_MAX
    = 3.465V * 25mA =
    86.6mW
    Power (outputs)
    MAX
    =
    30.2mW/Loaded Output pair
    Total Power
    _MAX
    (3.465V, with all outputs switching) =
    86.6mW + 30.2mW =
    116.6mW
    2. Junction Temperature.
    Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
    device. The maximum recommended junction temperature for HiPerClockS
    TM
    devices is 125°C.
    The equation for Tj is as follows: Tj =
    θ
    JA
    * Pd_total + T
    A
    Tj = Junction Temperature
    θ
    JA
    = Junction-to-Ambient Thermal Resistance
    Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
    T
    A
    = Ambient Temperature
    In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
    θ
    must be used. Assuming a
    moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 103.3°C/W per Table 5 below.
    Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
    85°C + 0.117W * 103.3°C/W = 97.1°C. This is well below the limit of 125°C.
    This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
    and the type of board (single layer or multi-layer).
    θ
    JA
    by Velocity (Linear Feet per Minute)
    T
    ABLE
    5. T
    HERMAL
    R
    ESISTANCE
    θ
    JA
    FOR
    8-
    PIN
    SOIC, F
    ORCED
    C
    ONVECTION
    0
    200
    500
    Single-Layer PCB, JEDEC Standard Test Boards
    Multi-Layer PCB, JEDEC Standard Test Boards
    153.3°C/W
    112.7°C/W
    128.5°C/W
    103.3°C/W
    115.5°C/W
    97.1°C/W
    NOTE:
    Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
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