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參數(shù)資料
| 型號(hào)： | ICS9DB306BF |
| 元件分類： | 時(shí)鐘及定時(shí) |
| 英文描述： | 9DB SERIES, PLL BASED CLOCK DRIVER, 6 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO28 |
| 封裝： | 5.30 X 10.20 MM, 1.75 MM HEIGHT, MO-150, SSOP-28 |
| 文件頁數(shù)： | 3/16頁 |
| 文件大小： | 268K |
| 代理商： | ICS9DB306BF |
9DB306BL
www.icst.com/products/hiperclocks.html
REV. B JUNE 16, 2006
11
Integrated
Circuit
Systems, Inc.
ICS9DB306
PCI EXPRESS,
JITTER ATTENUATOR
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS9DB306.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS9DB306 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX = VCC_MAX * IEE_MAX = 3.465V * 135mA = 467.8mW
Power (outputs)
MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 6 * 30mW = 180mW
Total Power
_MAX (3.465V, with all outputs switching) = 467.8mW + 180mW = 647.8mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 43.9°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.648W * 43.9°C/W = 98.4°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θθθθθ
JA by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
82.9°C/W
68.7°C/W
60.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
49.8°C/W
43.9°C/W
41.2°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
28-PIN TSSOP, FORCED CONVECTION
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| ICS9DB306BLILF | 功能描述:IC JITTER ATTENUATOR 28-TSSOP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 專用 系列:HiPerClockS™, PCI Express® (PCIe) 標(biāo)準(zhǔn)包裝:1,500 系列:- 類型:時(shí)鐘緩沖器/驅(qū)動(dòng)器 PLL:是 主要目的:- 輸入:- 輸出:- 電路數(shù):- 比率 - 輸入:輸出:- 差分 - 輸入:輸出:- 頻率 - 最大:- 電源電壓:3.3V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:28-SSOP（0.209"，5.30mm 寬） 供應(yīng)商設(shè)備封裝:28-SSOP 包裝:帶卷 (TR) 其它名稱:93786AFT |
| ICS9DB306BLILFT | 功能描述:IC JITTER ATTENUATOR 28-TSSOP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 專用 系列:HiPerClockS™, PCI Express® (PCIe) 標(biāo)準(zhǔn)包裝:1,500 系列:- 類型:時(shí)鐘緩沖器/驅(qū)動(dòng)器 PLL:是 主要目的:- 輸入:- 輸出:- 電路數(shù):- 比率 - 輸入:輸出:- 差分 - 輸入:輸出:- 頻率 - 最大:- 電源電壓:3.3V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:28-SSOP（0.209"，5.30mm 寬） 供應(yīng)商設(shè)備封裝:28-SSOP 包裝:帶卷 (TR) 其它名稱:93786AFT |
| ICS9DB306BLLF | 功能描述:IC JITTER ATTENUATOR 28TSSOP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 專用 系列:HiPerClockS™, PCI Express® (PCIe) 標(biāo)準(zhǔn)包裝:1 系列:- 類型:時(shí)鐘/頻率發(fā)生器，多路復(fù)用器 PLL:是 主要目的:存儲(chǔ)器，RDRAM 輸入:晶體 輸出:LVCMOS 電路數(shù):1 比率 - 輸入:輸出:1:2 差分 - 輸入:輸出:無/是 頻率 - 最大:400MHz 電源電壓:3 V ~ 3.6 V 工作溫度:0°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:Digi-Reel® 其它名稱:296-6719-6 |
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