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參數(shù)資料
| 型號(hào)： | ID1018 |
| 英文描述： | Intermodulation in RF Coaxial Connectors |
| 中文描述： | 互調(diào)射頻同軸連接器 |
| 文件頁(yè)數(shù)： | 2/8頁(yè) |
| 文件大小： | 295K |
| 代理商： | ID1018 |
converted to the frequency domain, this waveform
consists of the desired fundamental plus a decaying series
of related harmonics that, in themselves, interact with
other carriers present on the transmission line.
The effect of this interaction produces additional
frequencies, some of which occur where they are least
wanted (see fig. 4). The 2F1-F2 (3rd order IMP, IMP
3
),
3F1-F2 (5th order IMP, IMP
5
) and 4F1-F2 (7th order IMP,
IMP
7
) products can all manifest in the receive band and,
if sufficiently large, effectively block a channel by
making the base station receiver think that a carrier is
present when one is not.
Potential Causes of IM in Coaxial
Connectors
There are numerous factors which can affect
intermodulation performance in RF coaxial connectors.
Identified below are the most likely sources of concern:
Contaminated plating solution
Insufficient plating thickness
Corrosion
Dissimilar metals in intimate contact
Magnetic materials in the signal path
Low contact pressure
Less than 360-degree contact
Poor surface finish
Debris and dust within the connector
Convoluted signal path
Remedies for IM in RF Coaxial
Connectors
To combat the above identified IM sources,
M/A-COM undertakes precautions during the design
and manufacture of the product, as summarized below:
High quality plating to 6μm for IM-sensitive products
The plating must also be free from contaminants
and properly passivated with a chromate passivate.
Silver has been the preferred plating material as it
possesses the lowest practical resistivity thereby
minimizing interface contact resistances. M/A-COM
also offers a unique White Bronze plating finish which
provides excellent durability, tarnish resistance and
non-magnetic properties ideal for low inter-
modulation. During testing with a system noise floor
of -145 dBm, the difference in performance between
silver-plating and M/A-COM’s new White Bronze
finish is not discernible (refer to White Bronze
Application Note ID1014).
Restrict materials to copper and its alloys.
This ensures maximum plating adhesion and
minimum electrochemical potential difference be-
tween the base materials and their over-platings.
Avoid the use of stainless steel, nickel, ferrites, etc. in
the signal path
Magnetic and para-magnetic materials will only
compound non-linearites and give poorer interface
contact
resistances.
During
M/A-COM discovered a degradation in performance
of 20dB when nickel plate was used. The presence of
magnetic or para-magnetic materials will also cause
the forward IMP figure to differ from the reverse IMP.
experimentation,
Quality machining
Surface finish is paramount. The signal propagates
within a “skin” if this skin is too rough, the signal will
repeatedly transition through metal and surface oxide
layers, thereby creating the same effect as a poor panel
contact (see fig. 5). For IM-sensitive designs M/A-COM
ensures 0.4μm is the maximum.
Contact design
This primarily affects the connector interface.
Repeated matings can generate small amounts of
plating from the individual parts. These oxidize and
interfere with the mechanical (and therefore electrical)
mating of connectors. The oxidized debris gives
further rise to metal and surface oxide junctions and
consequently, higher IM products.
M/A-COM Division of AMP Incorporated
I
North America: Tel. (800) 366-2266, Fax (800) 618-8883
I
Asia/Pacific: Tel. +85 2 2111 8088, Fax +85 2 2111 8087
I
Europe: Tel. +44 (1344) 869 595, Fax +44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks.
Specifications subject to change without notice.
V4.00
Spectrum of products in a 2-tone system
Frequency (MHz)
Fig. 4
Rx band
Tx
band
3F2-F1
F1
F2
4F2-3F1
2F2-F2
2F2-F1
3F2-F1
4F2-3 F1
Carriers
%
120
100
80
60
40
20
0
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